Patents by Inventor Dan POUNDS

Dan POUNDS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat transfer panel having non-planar internal channels with single planar joint
    Patent number: 11515591
    Abstract: A heat rejection panel comprising a first and a second plate. The first plate comprises an oscillating heat pipe face having a plurality of first opened elongated recesses formed therein, and the second plate comprises an oscillating heat pipe face having a plurality of second open elongated recesses formed therein. The first plate oscillating heat pipe face is hermetically sealed to the second plate oscillating heat pipe face forming a bond joint therebetween. The first plate caps the second open elongated recesses and the second plate caps the first open elongated recesses such that first open elongated recesses are physically and fluidly connected to the second open elongated recesses, thereby forming at least one non-planar oscillating heat pipe channel within the panel that reciprocates back and forth across the bond joint having the bond joint as a longitudinal axis.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: November 29, 2022
    Assignee: ThermAvant Technologies, LLC
    Inventors: Benjamin Alexander, Dan Pounds
  • Loop heat pipe evaporator
    Patent number: 11408684
    Abstract: A loop heat pipe evaporator includes a porous primary wick, and a nonporous envelope unseparatingly surrounding the primary wick. The primary wick and the envelope are of one-piece construction.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: August 9, 2022
    Assignee: Advanced Cooling Technologies, Inc.
    Inventors: Bradley Richard, William Anderson, Richard W. Bonner, III, Devin Pellicone, Chien-Hua Chen, Greg Hoeschele, Taylor Maxwell, Dan Pounds, Dan Reist
  • NON-PLANAR INTERNAL CHANNELS WITH SINGLE PLANAR JOINT
    Publication number: 20220123388
    Abstract: A heat rejection panel comprising a first and a second plate. The first plate comprises an oscillating heat pipe face having a plurality of first opened elongated recesses formed therein, and the second plate comprises an oscillating heat pipe face having a plurality of second open elongated recesses formed therein. The first plate oscillating heat pipe face is hermetically sealed to the second plate oscillating heat pipe face forming a bond joint therebetween. The first plate caps the second open elongated recesses and the second plate caps the first open elongated recesses such that first open elongated recesses are physically and fluidly connected to the second open elongated recesses, thereby forming at least one non-planar oscillating heat pipe channel within the panel that reciprocates back and forth across the bond joint having the bond joint as a longitudinal axis.
    Type: Application
    Filed: October 16, 2020
    Publication date: April 21, 2022
    Inventors: Benjamin ALEXANDER, Dan POUNDS