Patents by Inventor Dan R. McCutchan

Dan R. McCutchan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6506073
    Abstract: The invention in one particular embodiment is a bracket including a base having an opening shaped to accommodate a socket for an integrated circuit device; and at least one containment member rigidly extending from the base to define a void shaped to accommodate the integrated circuit. In another embodiment, a method for mounting an integrated circuit device to a printed circuit board comprises affixing a bracket to the printed circuit board; mounting a socket to the printed circuit board; and coupling the integrated circuit to the socket, the integrated circuit being vertically and laterally constrained by the bracket.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: January 14, 2003
    Assignee: Intel Corporation
    Inventors: Dan R. McCutchan, Glen Patrick Gordon, Leonard Ottis Turner, Michael P. Brownell, Larry B. Wheeler
  • Publication number: 20010040795
    Abstract: The invention in one particular embodiment is a bracket including a base having an opening shaped to accommodate a socket for an integrated circuit device; and at least one containment member rigidly extending from the base to define a void shaped to accommodate the integrated circuit. In another embodiment, a method for mounting an integrated circuit device to a printed circuit board comprises affixing a bracket to the printed circuit board; mounting a socket to the printed circuit board; and coupling the integrated circuit to the socket, the integrated circuit being vertically and laterally constrained by the bracket.
    Type: Application
    Filed: August 5, 1999
    Publication date: November 15, 2001
    Inventors: DAN R. MCCUTCHAN, GLEN PATRICK GORDON, LEONARD OTTIS TURNER, MICHAEL P. BROWNELL, LARRY B. WHEELER
  • Patent number: 6166908
    Abstract: An integrated circuit cartridge has been described. The cartridge includes a heat pipe lid that comes in thermal contact with at least one integrated circuit die. The integrated circuit die is mounted on a substrate that is held in a cavity of a pin chassis that has a grid array of pins for interconnection with a socket. The integrated circuit die can be mounted on a secondary substrate that is mounted to a primary substrate. The substrate has an edge connector to supply power to the integrated circuit die, freeing the grid array of pins to be used for signal interconnects. The substrate has a grid of connections soldered to the grid array of pins on the pin chassis. The pin chassis also supplies key structures that aid in alignment of the pins and a socket.
    Type: Grant
    Filed: October 1, 1999
    Date of Patent: December 26, 2000
    Assignee: Intel Corporation
    Inventors: Bill Samaras, Michael Brownell, Dan R. McCutchan, Hong Xie
  • Patent number: 6164999
    Abstract: The invention in one embodiment is a zero insertion force socket including a base; a cover engaged with the base to reciprocate in first and second directions; and a lever pivotably mounted to the base to move the cover in the first direction when the lever is pivoted laterally from a first position to a second position. In another embodiment, the invention is a printed circuit board assembly including a printed circuit board; a zero insertion force socket surface mounted to the printed circuit board; and a processor coupled to the zero insertion force socket.
    Type: Grant
    Filed: July 30, 1997
    Date of Patent: December 26, 2000
    Assignee: Intel Corporation
    Inventors: Dan R. McCutchan, Glen Patrick Gordon, Leonard Ottis Turner, Michael P. Brownell, Larry B. Wheeler
  • Patent number: 6002591
    Abstract: The invention in one particular embodiment is a bracket including a base having an opening shaped to accommodate a socket for an integrated circuit device; and at least one containment member rigidly extending from the base to define a void shaped to accommodate the integrated circuit. In another embodiment, a method for mounting an integrated circuit device to a printed circuit board comprises affixing a bracket to the printed circuit board; mounting a socket to the printed circuit board; and coupling the integrated circuit to the socket, the integrated circuit being vertically and laterally constrained by the bracket.
    Type: Grant
    Filed: July 30, 1997
    Date of Patent: December 14, 1999
    Assignee: Intel Corporation
    Inventors: Dan R. McCutchan, Glen Patrick Gordon, Leonard Ottis Turner, Michael P. Brownell, Larry B. Wheeler
  • Patent number: 5980267
    Abstract: An improved connector scheme for a power pod power delivery system provides a low-resistance, low inductance path between a power source and a power consuming module. Specifically, the present invention is a connector scheme comprising a printed circuit board having a plurality of sets of planar pads, each of the plurality of sets of planar pads being coupled to a power source and/or a signal source, and a flexible connection for detachably coupling with each of the plurality of sets of planar pads on the printed circuit board.
    Type: Grant
    Filed: January 12, 1998
    Date of Patent: November 9, 1999
    Assignee: Intel Corporation
    Inventors: David J. Ayers, Bill Samaras, Dan R. McCutchan
  • Patent number: 5864478
    Abstract: A power delivery system includes a circuit board, a power consuming module and a dc--dc converter. The printed circuit board has on it a first signal connector, a pair of first contacts to which a first voltage is supplied, spaced from said connector, and fasteners spaced from said pair of first contacts. The power consuming module has a second signal connector, mating with the first signal connector, and has respective upper and lower power pads for receiving low voltage power. The dc--dc converter converts the first voltage to a lower voltage. The dc--dc converter has a pair of second contacts contacting said pair of first contacts, surfaces mating with said fasteners and holding the converter on the printed circuit board such that said second contacts are in firm contact with said first contacts, and a laterally extending connector having upper and lower contacts supplying the lower voltage and engaging the upper and lower power pads of the power consuming module.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: January 26, 1999
    Assignee: Intel Corporation
    Inventors: Dan R. McCutchan, William A. Samaras, David J. Ayers