Abstract: A sealing assembly for mating two sections of an electrical device enclosure is disclosed. The enclosure includes a top and bottom joinable section. The sealing assembly includes a first sealing section disposed on the top joinable section that has both first and second upper projecting lip extensions. The second upper projecting lip extension has a height less than the first upper projecting lip extension and forms a channel therebetween. A second sealing section is disposed on the bottom joinable section, and includes a downward projecting lip extension and channel. The downward projecting lip extension is offset from the first section first upward projecting lip extension when the top and bottom joinable sections are joined. At that point the downward projecting lip extension engages within the channel of the first sealing section, and the second upper projecting lip extension of said first sealing section is engaged within the second sealing section channel.