Abstract: A lead connector for an implantable medical device includes a cylindrical connector body having a proximal end and a distal end. A distal frame forms the distal end and a remainder of the connecter body is a mold material. A plurality of shafts extending through the distal frame from a rear face to a front face, the rear face abutting the mold material forming the remainder of the connector body. A plurality of ring contacts are in the connector body. A plurality of wires are coupled to a ring contact and extend through the mold material and through a corresponding one of the shafts. The mold material forming the remainder of the connector body extends partially into each shaft and about the corresponding conductive wire to form a plug.

Abstract: A lead connector for an implantable medical device includes a cylindrical connector body having a proximal end and a distal end. A distal frame forms the distal end and a remainder of the connecter body is a mold material. A plurality of shafts extending through the distal frame from a rear face to a front face, the rear face abutting the mold material forming the remainder of the connector body. A plurality of ring contacts are in the connector body. A plurality of wires are coupled to a ring contact and extend through the mold material and through a corresponding one of the shafts. The mold material forming the remainder of the connector body extends partially into each shaft and about the corresponding conductive wire to form a plug.

Abstract: A method of manufacturing a lead connector for an implantable medical device including connecting proximal ends of a plurality of conductive wires to an inner surface of a corresponding ring contact, placing a distal frame over distal ends of each of conducive wire of the plurality of conductive wires, the distal ends passing through corresponding shafts in the distal frame from a rear face of the distal frame and extending beyond a front face of the distal frame, arranging the distal frame along with the conductive wires and corresponding ring contacts within a mold cavity, filling the mold cavity with a mold material, the mold material abutting the rear face of the distal frame, and removing a resulting lead connector from the mold cavity.