Patents by Inventor Dan Riedl

Dan Riedl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190144106
    Abstract: A bearing assembly is for movably coupling first and second members, one being movable relative to the other. A plain bearing section includes an inner ring connectable with the first member and an outer convex bearing surface. An outer ring is disposed about the inner ring and has an inner concave bearing surface disposed against the inner ring bearing surface. The two bearing surfaces are formed such that one bearing surfaces slides against the other when the movable member displaces about a first axis and two bearing surfaces engage to prevent displacement between the two rings when the movable member displaces about a second axis. An elastomeric bearing section is disposed about the plain bearing section, is connected with the second member and formed such that at least a portion of the elastomeric bearing section flexes when the movable member angularly displaces about the second axis.
    Type: Application
    Filed: November 16, 2017
    Publication date: May 16, 2019
    Inventors: Dan Riedl, Lester James, Michael Colton, Will Curry
  • Patent number: 7177942
    Abstract: The present invention discloses a system for adjusting the speed of operation of a channel for communicating with disk drives in a multi ported system, comprising a bridge controller having a first channel and a second channel and a plurality of enclosure services modules, each having a first channel connected in sequence from a bridge controller to a first enclosure services module and successively connected to successive enclosure services modules to a last enclosure services module and each having a second channel connected in reverse sequence from the bridge controller to the last enclosure services module and successively connected to the successive enclosure services modules to the first enclosure services module.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: February 13, 2007
    Assignee: LSI Logic Corporation
    Inventors: James A. Lynn, Jeremy D. Stover, Jason M. Stuhsatz, Dan A. Riedl, Timothy Flynn