Abstract: Apparatus and a method for cleaning, rinsing and drying substrates, such as semiconductor wafers. The apparatus has a cleaning tank in which one or more megasonic transducers are located, the transducers being adapted to direct megasonic energy past the substrates for cleaning the same. The substrates are held in the cleaning tank by an improved holder which can be pivoted from one side to the other to present opposite side margins of the substrates to the megasonic energy field when otherwise such opposite side margins would not be exposed to such energy field due to the blocking action of parts of the holder. A rinse tank for containing a rinse solution is adjacent to the cleaning tank, and a robotic transfer arm mechanism moves the substrates in the holder from the cleaning tank to the rinse tank for immersion of the substrates into the rinse solution which can be heated to an elevated temperature or can be at ambient temperature.

Abstract: Apparatus and a method for cleaning, rinsing and drying substrates, such as semiconductor wafers. The apparatus has a cleaning tank in which one or more megasonic transducers are located, the transducers being adapted to direct megasonic energy past the substrates for cleaning the same. The substrates are held in the cleaning tank by an improved holder which can be pivoted from one side to the other to present opposite side margins of the substrates to the megasonic energy field when otherwise such opposite side margins would not be exposed to such energy field due to the blocking action of parts of the holder. A rinse tank for containing a rinse solution is adjacent to the cleaning tank, and a robotic transfer arm mechanism moves the substrates in the holder from the cleaning tank to the rinse tank for immersion of the substrates into the rinse solution which can be heated to an elevated temperature or can be at ambient temperature.