Patents by Inventor Dan Solvin

Dan Solvin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally enhanced memory module
    Patent number: 7606034
    Abstract: A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.
    Type: Grant
    Filed: June 4, 2007
    Date of Patent: October 20, 2009
    Assignee: Corsair Memory
    Inventors: Andy Paul, Dan Solvin, Don Lieberman, John S. Beekley, Martin E. Mueller, Robert Pearce
  • Managing memory modules
    Patent number: 7584006
    Abstract: A method and system for managing memory modules or memory devices is disclosed. The memory modules or memory devices are managed by using a microcontroller on the memory module. A user can remotely control the memory module by sending instructions and data to the microcontroller. The microcontroller can cause the measurement of a number of operational parameters of the memory module. The values of the measured operational parameters can be displayed on a display unit that is attached to the memory module or displayed on a screen associated with the host system.
    Type: Grant
    Filed: November 15, 2005
    Date of Patent: September 1, 2009
    Assignee: Corsair Memory
    Inventors: Andy Paul, John Beekley, Don Lieberman, Dan Solvin, Robert Pearce, Martin Mueller
  • Thermally Enhanced Memory Module
    Publication number: 20070285898
    Abstract: A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.
    Type: Application
    Filed: June 4, 2007
    Publication date: December 13, 2007
    Inventors: Andy Paul, Dan Solvin, Don Lieberman, John Beekley, Martin Mueller, Robert Pearce
  • Managing memory modules
    Publication number: 20060149960
    Abstract: A method and system for managing memory modules or memory devices is disclosed. The memory modules or memory devices are managed by using a microcontroller on the memory module. A user can remotely control the memory module by sending instructions and data to the microcontroller. The microcontroller can cause the measurement of a number of operational parameters of the memory module. The values of the measured operational parameters can be displayed on a display unit that is attached to the memory module or displayed on a screen associated with the host system.
    Type: Application
    Filed: November 15, 2005
    Publication date: July 6, 2006
    Inventors: Andy Paul, John Beekley, Don Lieberman, Dan Solvin, Robert Pearce, Martin Mueller