Patents by Inventor Dan Swindler

Dan Swindler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5526337
    Abstract: A package for a holographic storage media disk (10) is provided that is comprised of a super structure (18) that is operable to hold the disk (10). The disk (10) is comprised of a photopolymer material that is formed in a disk-shaped member having a hub (14) disposed at the center thereof. The disk (10) is disposed in the structure (18) and then a cover (24) disposed thereover, the cover (24) being opaque. An access opening (28) is disposed within the cover (24) to allow access to the surface of the disk (10). A hub opening (26) is provided for allowing access to the hub (14). The hub (14) is disposed such that there is a light tight seal relative to the cover (24). A door (32) is provided for reciprocating over the opening (28) to light seal the package when data is not being recorded to the disk (10) or read therefrom.
    Type: Grant
    Filed: June 30, 1994
    Date of Patent: June 11, 1996
    Assignee: Tamarack Storage Devices
    Inventors: Randal Housey, Vincent D. McCarty, Dan Swindler, Lindsay Gupton, Duane S. Dewald
  • Patent number: 5424913
    Abstract: Disclosed is an access door for computer systems comprising an outer case containing an electronic component of the computer system that is capable of generating heat during the operation of the computer system. The outer case has an aperture in its surface proximate the component to allow external access into the outer case. The access door is capable of assuming a closed position where it closes the aperture, covers the component and forms a part of the outer. The access door is also capable of being placed in an open position wherein the component is externally exposed through the aperture. The access door includes a heat sink having a heat receiving portion positioned to mechanically contact a surface of the component to allow transmission of heat from the component to the heat receiving portion.
    Type: Grant
    Filed: January 11, 1994
    Date of Patent: June 13, 1995
    Assignee: Dell USA, L.P.
    Inventor: Dan Swindler