Abstract: An inductive touch sensor comprises an inductors disposed in or on a deformable substrate. When a force is applied to the deformable substrate the physical shape of the inductor will change and thereby change its inductance value. The change in the inductance value can be detected and used to indicate actuation of an associated touch key of the inductive touch sensor. A plurality of inductive touch sensors may be used to form a touch panel.

Abstract: An inductive touch sensor comprises an inductors disposed in or on a deformable substrate. When a force is applied to the deformable substrate the physical shape of the inductor will change and thereby change its inductance value. The change in the inductance value can be detected and used to indicate actuation of an associated touch key of the inductive touch sensor. A plurality of inductive touch sensors may be used to form a touch panel.

Abstract: A method for attaching an integrated circuit die to a mounting structure, the method having the steps of: forming a mounting structure having a die pad and at least one spreader; applying an adhesive to the die pad and the at least one spreader of the mounting structure; and attaching the integrated circuit die to the adhesive, wherein the at least one spreader is between the die pad and the integrated circuit die. Also, an integrated circuit package having: a mounting structure having a die pad and at least one spreader; an adhesive adhered to the die pad and the at least one spreader of the mounting structure; and an integrated circuit die adhered to the adhesive, wherein the at least one spreader is between the die pad and the integrated circuit die. Finally, a mounting structure for an integrated circuit die, the mounting structure comprising: a die pad for supporting the integrated circuit die; and at least one spreader for supporting the integrated circuit die at a distance from the die pad.