Patents by Inventor Dan WENZEL

Dan WENZEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240405483
    Abstract: A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
    Type: Application
    Filed: August 13, 2024
    Publication date: December 5, 2024
    Inventors: Kirk B. Peloza, Vivek Shah, Andrew Kolak, Dan Wenzel, Matt Cox, Ayman Isaac
  • Patent number: 12100912
    Abstract: A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
    Type: Grant
    Filed: October 17, 2023
    Date of Patent: September 24, 2024
    Assignee: Molex, LLC
    Inventors: Kirk B. Peloza, Vivek Shah, Andrew Kolak, Dan Wenzel, Matt Cox, Ayman Isaac
  • Publication number: 20240047923
    Abstract: A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
    Type: Application
    Filed: October 17, 2023
    Publication date: February 8, 2024
    Inventors: Kirk B. Peloza, Vivek Shah, Andrew Kolak, Dan Wenzel, Matt Cox, Ayman Isaac
  • Patent number: 11848522
    Abstract: Input/output (I/O) connectors (1) for conducting data at high data rates, (e.g. 112 gigabits per second or more) are provided with protective shields (4, 5, 6) to provide increased mechanical strength and signal integrity.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: December 19, 2023
    Assignee: Molex, LLC
    Inventors: Kirk B. Peloza, Vivek Shah, Andrew Kolak, Dan Wenzel, Matt Cox, Ayman Isaac
  • Publication number: 20210408729
    Abstract: Input/output (I/O) connectors (1) for conducting data at high data rates, (e.g. 112 gigabits per second or more) are provided with protective shields (4, 5, 6) to provide increased mechanical strength and signal integrity.
    Type: Application
    Filed: December 3, 2019
    Publication date: December 30, 2021
    Applicant: Molex, LLC
    Inventors: Kirk B. PELOZA, Vivek SHAH, Andrew KOLAK, Dan WENZEL, Matt COX, Ayman ISAAC