Abstract: The present disclosure concerns a system for imaging and monitoring fluids to identify the presence of objects therein. Objects that are being identified by the system include, for example, microorganisms, particles, bacteria, cells, foreign substances (e.g. bubbles of air in a liquid, substance that may change visual parameters of the main liquid such as color and transparency), etc. Identification of the objects by the system is then may be followed by analysis to conclude the status of the system (e.g. identifying contamination, impurities, etc.

Abstract: The present invention provides a method for identifying biological objects on a substrate; the method comprises: (i) illuminating the substrate carrying the biological objects with a light beam; (ii) acquiring at least one optical image of the illuminated substrate; the light beam comprises a wavelength band, the wavelength band is selected to induce at least one optical aberration in the optical image of the illuminated substrate; the optical aberration is predetermined as characterizing the biological objects; and (iii) processing said at least one optical image to provide a value or a combination of values indicative of presence or absence of said at least one optical aberration; said value or combination of values permitting detection or identification of the biological objects on said substrate. The invention also provides a processing unit, a system and a database for use in connection with the method of the invention.

Abstract: The present invention provides a method for identifying biological objects on a substrate; the method comprises: (i) illuminating the substrate carrying the biological objects with a light beam; (ii) acquiring at least one optical image of the illuminated substrate; the light beam comprises a wavelength band, the wavelength band is selected to induce at least one optical aberration in the optical image of the illuminated substrate; the optical aberration is predetermined as characterizing the biological objects; and (iii) processing said at least one optical image to provide a value or a combination of values indicative of presence or absence of said at least one optical aberration; said value or combination of values permitting detection or identification of the biological objects on said substrate. The invention also provides a processing unit, a system and a database for use in connection with the method of the invention.

Abstract: A method for imaging a body, including scanning the body so as to generate a tomographic image thereof, and analyzing the tomographic image to determine a location of a region of interest (ROI) (38) within the body. The method includes providing single photon counting detector modules (40), each of the modules being configured to receive photons from a respective direction and to generate a signal in response thereto. The method further includes coupling each of the modules to a respective adjustable mount (54), adjusting each of the adjustable mounts so that the direction of the module coupled thereto is aligned with respect to the location so as to receive radiation from the ROI, operating each of the modules to receive the photons from the ROI, and, in response to the signal generated by each of the modules, generating a single photon counting image of the ROI.

Abstract: A flat surface tilting device including a selectably positionable flat surface element assembly defining a flat surface element having a flat surface and a pivot location portion, the pivot location portion being generally centered with respect to the flat surface, a pivot support element pivotably engaging the pivot location portion, an electromagnet, fixed with respect to the pivot support element and arranged for application of magnetic force in a direction generally perpendicular to the flat surface thereby to pivot the flat surface element about the pivot support element, a sensor for sensing the position of the flat surface element and feedback circuitry operative in response to an output of the sensor to govern operation of the electromagnet.

Abstract: A low-inertia flat surface tilting device including a selectably positionable flat surface element assembly defining a flat surface element having a flat surface and a pivot location portion, the pivot location portion being generally centered with respect to the flat surface, a pivot support element pivotably engaging the pivot location portion, an electromagnet, fixed with respect to the pivot support element and arranged for application of magnetic force in a direction generally perpendicular to the flat surface thereby to pivot the flat surface element about the pivot support element, a sensor for sensing the position of the flat surface element and feedback circuitry operative in response to an output of the sensor to govern operation of the electromagnet.

Abstract: A first inspection functionality is provided to obtain information about a first attribute at a conductor location on an electrical circuit. A second inspection functionality is provided to obtain information about a second attribute at the conductor location. A combination of first attribute information and second attribute information is analyzed to determine an inspection attribute of the conductor at the conductor location. Attribute information may relate to one or more of: reflectance, fluorescence or height.

Abstract: Apparatus for electrical testing of electrical circuits includes an array of probes arranged for selective engagement with portions of electrical circuits to be tested, testing circuitry associated with the array of probes for sensing electrical characteristics of the electrical circuits engaged by the array of probes, and control circuitry associated with the array of probes for causing engagement between selected ones of the array of probes with selected ones of the portions of electrical circuits to be tested. The array of probes includes at least two static probe assemblies arranged in a fixed array, and the static probe assemblies include a selectively positionable probe element and a probe element positioner. The apparatus is employed to test electrical circuits during fabrication.

Abstract: A first inspection functionality is provided to obtain information about a first attribute at a conductor location on an electrical circuit. A second inspection functionality is provided to obtain information about a second attribute at the conductor location. A combination of first attribute information and second attribute information is analyzed to determine an inspection attribute of the conductor at the conductor location. Attribute information may relate to one or more of: reflectance, fluorescence or height.

Abstract: A first inspection functionality is provided to obtain information about a first attribute at a conductor location on an electrical circuit. A second inspection functionality is provided to obtain information about a second attribute at the conductor location. A combination of first attribute information and second attribute information is analyzed to determine an inspection attribute of the conductor at the conductor location. Attribute information may relate to one or more of: reflectance, fluorescence or height.

Abstract: Apparatus for electrical testing of electrical circuits includes an array of probes arranged for selective engagement with portions of electrical circuits to be tested, testing circuitry associated with the array of probes for sensing electrical characteristics of the electrical circuits engaged by the array of probes, and control circuitry associated with the array of probes for causing engagement between selected ones of the array of probes with selected ones of the portions of electrical circuits to be tested. The array of probes includes at least two static probe assemblies arranged in a fixed array, and the static probe assemblies include a selectively positionable probe element and a probe element positioner. The apparatus is employed to test electrical circuits during fabrication.

Abstract: Apparatus for electrical testing of electrical circuits includes an array of probes arranged for selective engagement with portions of electrical circuits to be tested, testing circuitry associated with the array of probes for sensing electrical characteristics of the electrical circuits engaged by the array of probes, and control circuitry associated with the array of probes for causing engagement between selected ones of the array of probes with selected ones of the portions of electrical circuits to be tested. The array of probes includes at least two static probe assemblies arranged in a fixed array, and the static probe assemblies include a selectively positionable probe element and a probe element positioner. The apparatus is employed to test electrical circuits during fabrication.

Abstract: An optical inspection system has a topology sensing assembly. A height detector detects whether a region of a circuit has a height different from a height of the surface, and provides height data. A topology representation of the circuit, based on the height data, forms the basis for a reduced representation of the topology, and subsequent defect analysis.

Abstract: A first inspection functionality is provided to obtain information about a first attribute at a conductor location on an electrical circuit. A second inspection functionality is provided to obtain information about a second attribute at the conductor location. A combination of first attribute information and second attribute information is analyzed to determine an inspection attribute of the conductor at the conductor location. Attribute information may relate to one or more of: reflectance, fluorescence or height.

Abstract: A system and method for forming bumps on an integrated circuit including a scanning direct laser imager employed to selectably expose a photosensitive layer deposited on an integrated circuit substrate, thereby to define regions overlying selected portions of the substrate, a developer developing said photosensitive layer to form apertures in the photosensitive layer at the defined regions, and a solder applicator applying a solder composition to the apertures to define solder bumps on the integrated circuit at selected portions thereof.

Abstract: An optical inspection system has a topology sensing assembly. A height detector detects whether a region of a circuit has a height different from a height of the surface, and provides height data. A topology representation of the circuit, based on the height data, forms the basis for a reduced representation of the topology, and subsequent defect analysis.

Abstract: A system and method for forming bumps on an integrated circuit including a scanning direct laser imager employed to selectably expose a photosensitive layer deposited on an integrated circuit substrate, thereby to define regions overlying selected portions of the substrate, a developer developing said photosensitive layer to form apertures in the photosensitive layer at the defined regions, and a solder applicator applying a solder composition to the apertures to define solder bumps on the integrated circuit at selected portions thereof.

Abstract: Apparatus for electrical testing of electrical circuits includes an array of probes arranged for selective engagement with portions of electrical circuits to be tested, testing circuitry associated with the array of probes for sensing electrical characteristics of the electrical circuits engaged by the array of probes, and control circuitry associated with the array of probes for causing engagement between selected ones of the array of probes with selected ones of the portions of electrical circuits to be tested. The array of probes includes at least two static probe assemblies arranged in a fixed array, and the static probe assemblies include a selectively positionable probe element and a probe element positioner. The apparatus is employed to test electrical circuits during fabrication.