Patents by Inventor Dana A. Stoddard

Dana A. Stoddard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder ball landpad design to improve laminate performance
    Patent number: 7951646
    Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
    Type: Grant
    Filed: April 23, 2003
    Date of Patent: May 31, 2011
    Assignee: Round Rock Research, LLC
    Inventors: Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
  • Solder ball landpad design to improve laminate performance
    Patent number: 6914326
    Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
    Type: Grant
    Filed: April 23, 2003
    Date of Patent: July 5, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
  • Solder ball landpad design to improve laminate performance
    Publication number: 20030205807
    Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
    Type: Application
    Filed: April 23, 2003
    Publication date: November 6, 2003
    Inventors: Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
  • Solder ball landpad design to improve laminate performance
    Publication number: 20030193089
    Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
    Type: Application
    Filed: April 23, 2003
    Publication date: October 16, 2003
    Inventors: Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
  • Solder ball landpad design to improve laminate performance
    Patent number: 6577004
    Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: June 10, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Brad D. Rumsey, Patrick W. Tandy, William J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young