Abstract: An assembly for dissipating heat from an active matrix liquid crystal display module while avoiding developing thermally induced mechanical stresses which can adversely affect the electro-optical properties of the liquid crystal material is disclosed. The module is affixed to a circuit board containing electrical leads for connection to drive electronics, in a way such that the substrate containing the active matrix elements is suspended through a window or through-hole in the circuit board and is sunken or nested into a soft elastomeric gel which is electrically non-conductive but thermally conductive. The gel provides the requisite thermal conductivity to dissipate the heat via a heat sink with which the gel is in thermal contact.

Abstract: A support rack is shown as constructed of stainless steel angle members permanently welded together so as to comply with seismic requirements for nuclear power plant components. The four basic sides of the rack form a rectangle with the longer sides vertically extended. Permanent stainless steel plates extend between the vertical sides of the rack to add to the overall stability of the rack and form mounting bases. To some of the mounting bases is removably connected a second plate which bears signal transducers and transmitters. The rack is adapted for both floor and wall mounting at its permanent station.