Patents by Inventor Dana D. Wentworth

Dana D. Wentworth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reflow process for mixed technology on a printed wiring board
    Patent number: 5680985
    Abstract: This invention relates to a method of combining a plurality of surface mount technology components and at least one plated through-hole component on a printed wiring board. The method includes applying to a secondary side of the printed wiring board a first layer of a preselected quantity of electrically conductive adhesive and then attaching a first portion of the plurality of the surface mount technology components to the adhesive. The first layer of the adhesive is then reflowed, thereby adhering the first portion of the plurality of surface mount technology components to the secondary side of the printed wiring board. The method then continues by applying to a primary side of the printed wiring board a second layer of the first preselected quantity of electrically conductive adhesive and applying to the primary side of the printed wiring board a second preselected quantity of electrically conductive adhesive.
    Type: Grant
    Filed: February 6, 1996
    Date of Patent: October 28, 1997
    Assignee: Sundstrand Corporation
    Inventor: Dana D. Wentworth
  • Reflow process for mixed technology on a printed wiring board
    Patent number: 5373984
    Abstract: This invention relates to a method of combining a plurality of surface mount technology components and at least one plated through-hole component on a printed wiring board. The method includes applying to a secondary side of the printed wiring board a first layer of a preselected quantity of electrically conductive adhesive and then attaching a first portion of the plurality of the surface mount technology components to the adhesive. The first layer of the adhesive is then reflowed, thereby adhering the first portion of the plurality of surface mount technology components to the secondary side of the printed wiring board. The method then continues by applying to a primary side of the printed wiring board a second layer of the first preselected quantity of electrically conductive adhesive and applying to the primary side of the printed wiring board a second preselected quantity of electrically conductive adhesive.
    Type: Grant
    Filed: September 27, 1993
    Date of Patent: December 20, 1994
    Assignee: Sundstrand Corporation
    Inventor: Dana D. Wentworth