Abstract: The preferred embodiment of the present invention provides an apparatus and method to facilitate the testing of semiconductor devices packaged in surface mount modules (such as ball grid array modules and cylinder grid array modules) while the module is connected to a system board. The preferred embodiment provides an interposer mechanism that includes a top array of interposer landing pads and a bottom array of interposer landing pads. The bottom array of interposer landing pads are connected to the top array of interposer landing pads. The preferred embodiment also provides a module test card mechanism. The module test card mechanism includes a plurality of landing pads arranged to receive the surface mount module. The plurality of landing pads are connected to a plurality of test pins, and a plurality of landing pads underneath the module test card mechanism.

Abstract: A bus interface system and method for communication between different computer components having buses with different speeds, data widths, or protocols. A first state machine communicates with the first bus and a second state machine communicates with the second bus. Each of the buses communicates with a data storage device. The first and second state machines are in selective communication using an asynchronous handshaking protocol, whereby data is transferred between said first and second buses. The handshaking protocol comprises an asynchronous request signal from the first bus requesting a data transfer and an asynchronous reply signal from the second bus indicating that data has been sent or is available.