Abstract: In one embodiment, a method includes attaching a film to cover a first portion of a first semiconductor die. The first semiconductor die is attached, using the tape, to a lead frame using a first bonding method. The first bonding method places the film between the lead frame and the semiconductor die. A second semiconductor die is attached to the lead frame using a second bonding method. The second bonding method bonds the lead frame and the semiconductor die. The first semiconductor device and the second semiconductor device are encapsulated into a semiconductor package.

Abstract: In one embodiment, a method for manufacturing a power semiconductor package is provided. The method includes attaching a plurality of solders balls onto a power semiconductor device. The plurality of solder balls are attached onto a lead frame using a flip bond processing step. The flip bond processing step bonds the semiconductor device to the lead frame and interconnects the lead frame to the semiconductor device in a single processing step. The semiconductor device, plurality of solder balls, and the lead frame are molded to form the power semiconductor package, wherein semiconductor device is exposed on a first side of the semiconductor package.

Abstract: In one embodiment, a method for manufacturing a saw type pad is provided. The method includes performing a first molding process to form a first molded layer beneath a pad of a lead frame. A semiconductor device is placed on the pad. A second molding process is performed to form a second molded layer. The first molded layer and the second molded layer form an encapsulation to enclose the semiconductor device and the pad. The lead frame is singulated to form an individualized semiconductor package. The pad is not exposed from a bottom surface of the semiconductor package.

Abstract: In one embodiment, a method includes attaching a film to cover a first portion of a first semiconductor die. The first semiconductor die is attached, using the tape, to a lead frame using a first bonding method. The first bonding method places the film between the lead frame and the semiconductor die. A second semiconductor die is attached to the lead frame using a second bonding method. The second bonding method bonds the lead frame and the semiconductor die. The first semiconductor device and the second semiconductor device are encapsulated into a semiconductor package.

Abstract: A removable computer peripheral device includes a pull-out bay, a rotabable mechanism installed in one side of the pull-out bay and including a signal connector, a mounting rack attached to the signal connector, the mounting rack rotatably installed in the pull-out bay. It is very convenient users because the mounting rack can be rotated to the position where the peripheral device can be installed to pull-out bay without limitation of space.