Patents by Inventor Dana R. DeReus
Dana R. DeReus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10882736Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: GrantFiled: January 28, 2019Date of Patent: January 5, 2021Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, WISPRY, INCInventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Publication number: 20190152768Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: ApplicationFiled: January 28, 2019Publication date: May 23, 2019Applicant: WiSpry, Inc.Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Patent number: 10227230Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: GrantFiled: July 10, 2018Date of Patent: March 12, 2019Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, WISPRY, INC.Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Publication number: 20180319653Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: ApplicationFiled: July 10, 2018Publication date: November 8, 2018Applicant: WiSpry, Inc.Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Patent number: 10081534Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: GrantFiled: June 4, 2015Date of Patent: September 25, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Publication number: 20150266718Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: ApplicationFiled: June 4, 2015Publication date: September 24, 2015Applicant: WISPRY, INC.Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Patent number: 9102517Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: GrantFiled: August 22, 2012Date of Patent: August 11, 2015Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, WISPRY, INC.Inventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Patent number: 8673671Abstract: Methods and devices for fabricating tri-layer beams are provided. In particular, disclosed are methods and structures that can be used for fabricating multilayer structures through the deposition and patterning of at least an insulation layer, a first metal layer, a beam oxide layer, a second metal layer, and an insulation balance layer.Type: GrantFiled: November 19, 2012Date of Patent: March 18, 2014Assignee: Wispry, Inc.Inventors: Shawn J. Cunningham, Dana R. DeReus, Arthur S. Morris, III
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Publication number: 20140054728Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.Type: ApplicationFiled: August 22, 2012Publication date: February 27, 2014Applicants: WISPRY, INC., INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Publication number: 20030021004Abstract: An optical MEMS device is fabricated in either a surface or bulk micromachining process wherein an integral process step entails providing an antireflective coating on one or more surfaces of a substrate through which optical information is to be transmitted. In one method, a surface micromachining process is carried out in which a sacrificial layer is formed and patterned on an optically transmissive substrate. A structural layer is formed on the sacrificial layer and fills in regions of the sacrificial layer that have been removed. An amount of the sacrificial layer is removed sufficient to define and release a microstructure and thereby render the microstructure movable for interaction with an optical signal directed toward the optically transmissive substrate. In another method, a bulk micromachining process is carried out in which a first substrate is provided that is composed of an optically transmissive material.Type: ApplicationFiled: December 19, 2001Publication date: January 30, 2003Inventors: Shawn Jay Cunningham, Svetlana Tatic-Lucic, Dana R. DeReus
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Publication number: 20020113281Abstract: MEMS Device having an Actuator with Curved Electrodes. According to one embodiment of the present invention, an actuator is provided for moving an actuating device linearly. The actuator includes a substrate having a planar surface and an actuating device movable in a linear direction relative to the substrate. The actuator includes at least one electrode beam attached to the actuating device and having an end attached to the substrate. The electrode beam is flexible between the actuating device and the end of the electrode beam attached to the substrate. Furthermore, the actuator includes at least one electrode attached to the substrate. The electrode has a curved surface aligned in a position adjacent the length of the electrode beam, whereby the actuating device is movable in its substantially linear direction as the electrode beam moves in a curved fashion corresponding substantially to the curved surface of the electrode.Type: ApplicationFiled: December 19, 2001Publication date: August 22, 2002Inventors: Shawn Jay Cunningham, Dana R. DeReus
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Publication number: 20020104823Abstract: Fabrication Integration of Micro-Components. A method for manufacturing a first and second micro-component on a surface of a substrate, including fabricating a first and second constraint structure. The first and second constraint structures are substantially formed to fit a surface of the first and second micro-component, respectively, for positioning the first and second micro-components with respect to each other. The method includes fabricating the first and second micro-components in separate processes. The first and second micro-components have a surface substantially formed to fit the first and second constraint structures, respectively.Type: ApplicationFiled: January 8, 2002Publication date: August 8, 2002Inventors: Shawn J. Cunningham, Dana R. DeReus, Arthur S. Morris
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Publication number: 20020086456Abstract: An optical MEMS device is fabricated by forming and aperture through the thickness of a first substrate to enable an optical signal to be transmitted through the aperture. A movable, actuatable microstructure is formed on a second substrate. The second substrate is bonded to the first substrate. The first and second substrates are aligned to enable the microstructure to interact with the optical signal upon actuation of the microstructure. A conductive element is formed on the first substrate to serve as a contact or an interconnect. A channel is formed in the second substrate. An insulating layer can be deposited on the inside surfaces of this channel. When the first and second substrates are bonded together, the conductive element formed on the first substrate is disposed within the channel and is isolated from conductive regions of the resulting optical MEMS device.Type: ApplicationFiled: December 19, 2001Publication date: July 4, 2002Inventors: Shawn Jay Cunningham, Svetlana Tacic-Lucic, Dana R. DeReus