Abstract: A MEMS switch includes: a housing, a switching assembly; a first actuation electrode, a first contact, a second contact, and a second actuation electrode. The switching device has a stress gradient along the thickness direction, such that in response to applying no voltage between the first actuation electrode and the second actuation electrode, the switching assembly contacts with the first contact. In response to applying a first voltage between the third actuation electrode and the fourth actuation electrode, the switching assembly is driven to deflect such that the switching assembly is spaced apart from both the first contact and the second contact. In response to applying a second voltage between the third actuation electrode and the fourth actuation electrode, the switching assembly is driven to deflect such that the switching assembly contacts with the second contact. The first voltage is smaller than the third voltage.

Abstract: A MEMS switch includes: a housing, a switching assembly; a first actuation electrode, a first contact, a second contact, and a second actuation electrode. The switching device has a stress gradient along the thickness direction, such that in response to applying no voltage between the first actuation electrode and the second actuation electrode, the switching assembly contacts with the first contact. In response to applying a first voltage between the third actuation electrode and the fourth actuation electrode, the switching assembly is driven to deflect such that the switching assembly is spaced apart from both the first contact and the second contact. In response to applying a second voltage between the third actuation electrode and the fourth actuation electrode, the switching assembly is driven to deflect such that the switching assembly contacts with the second contact. The first voltage is smaller than the third voltage.

Abstract: The present subject matter relates to devices, systems, and methods for isolation of electrostatic actuators in MEMS devices to reduce or minimize dielectric charging. A tunable component can include a fixed actuator electrode positioned on a substrate, a movable actuator electrode carried on a movable component that is suspended over the substrate, one or more isolation bumps positioned between the fixed actuator electrode and the movable actuator electrode, and a fixed isolation landing that is isolated within a portion of the fixed actuator electrode that is at, near, and/or substantially aligned with each of the one or more isolation bumps. In this arrangement, the movable actuator electrode can be selectively movable toward the fixed actuator electrode, but the one or more isolation bumps can prevent contact between the fixed and movable actuator electrodes, and the fixed isolation landing can inhibit the development of an electric field in the isolation bump.

Abstract: Methods for Implementation of a Switching Function in a Microscale Device and for Fabrication of a Microscale Switch. According to one embodiment, a method is provided for implementing a switching function in a microscale device. The method can include providing a stationary electrode and a stationary contact formed on a substrate. Further, a movable microcomponent suspended above the substrate can be provided. A voltage can be applied between the between a movable electrode of the microcomponent and the stationary electrode to electrostatically couple the movable electrode with the stationary electrode, whereby the movable component is deflected toward the substrate and a movable contact moves into contact with the stationary contact to permit an electrical signal to pass through the movable and stationary contacts. A current can be applied through the first electrothermal component to produce heating for generating force for moving the microcomponent.

Abstract: Cantilever beam electrostatic actuators are disclosed. A cantilever beam electrostatic actuator in accordance with the present invention comprises an actuator beam having a first width at a support anchor point and a second width at a distal end of the actuator, wherein the first width is narrower than the second width. Another actuator in accordance with the present invention comprises an actuator region, having a first width, a beam, having a second width, coupled between an edge of the actuator region and a pivot point, the beam being approximately centered on the actuator region, wherein the second width is narrower than the first width, and at least one auxiliary actuator flap, coupled to the actuator region, the at least one auxiliary actuator flap coupled to the actuator region along the edge of the actuator region, the at least one auxiliary actuator flap being farther away from a centerline of the actuator than the beam.

Abstract: MEMS Device having Electrothermal Actuation and Release and Method for Fabricating. According to one embodiment, a microscale switch is provided and can include a substrate and a stationary electrode and stationary contact formed on the substrate. The switch can further include a movable microcomponent suspended above the substrate. The microcomponent can include a structural layer including at least one end fixed with respect to the substrate. The microcomponent can further include a movable electrode spaced from the stationary electrode and a movable contact spaced from the stationary electrode. The microcomponent can include an electrothermal component attached to the structural layer and operable to produce heating for generating force for moving the structural layer.

Abstract: Cantilever beam electrostatic actuators are disclosed. A cantilever beam electrostatic actuator in accordance with the present invention comprises an actuator beam having a first width at a support anchor point and a second width at a distal end of the actuator, wherein the first width is narrower than the second width. Another actuator in accordance with the present invention comprises an actuator region, having a first width, a beam, having a second width, coupled between an edge of the actuator region and a pivot point, the beam being approximately centered on the actuator region, wherein the second width is narrower than the first width, and at least one auxiliary actuator flap, coupled to the actuator region, the at least one auxiliary actuator flap coupled to the actuator region along the edge of the actuator region, the at least one auxiliary actuator flap being farther away from a centerline of the actuator than the beam.

Abstract: MEMS Device Having Contact and Standoff Bumps and Related Methods. According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves.

Abstract: MEMS Device Having A Trilayered Beam And Related Methods. According to one embodiment, a movable, trilayered microcomponent suspended over a substrate is provided and includes a first electrically conductive layer patterned to define a movable electrode. The first metal layer is separated from the substrate by a gap. The microcomponent further includes a dielectric layer formed on the first metal layer and having an end fixed with respect to the substrate. Furthermore, the microcomponent includes a second electrically conductive layer formed on the dielectric layer and patterned to define an electrode interconnect for electrically communicating with the movable electrode.

Abstract: MEMS Device having Electrothermal Actuation and Release and Method for Fabricating. According to one embodiment, a microscale switch is provided and can include a substrate and a stationary electrode and stationary contact formed on the substrate. The switch can further include a movable microcomponent suspended above the substrate. The microcomponent can include a structural layer including at least one end fixed with respect to the substrate. The microcomponent can further include a movable electrode spaced from the stationary electrode and a movable contact spaced from the stationary electrode. The microcomponent can include an electrothermal component attached to the structural layer and operable to produce heating for generating force for moving the structural layer.

Abstract: MEMS Device Having Contact and Standoff Bumps and Related Methods. According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves.

Abstract: MEMS Device Having A Trilayered Beam And Related Methods. According to one embodiment, a movable, trilayered microcomponent suspended over a substrate is provided and includes a first electrically conductive layer patterned to define a movable electrode. The first metal layer is separated from the substrate by a gap. The microcomponent further includes a dielectric layer formed on the first metal layer and having an end fixed with respect to the substrate. Furthermore, the microcomponent includes a second electrically conductive layer formed on the dielectric layer and patterned to define an electrode interconnect for electrically communicating with the movable electrode.

Abstract: An optical MEMS device and a package include an optical through path for allowing light to pass from a first side of the package, through a substrate on which the optical MEMS device is mounted and through a second side of the package opposite the first side. The package can include first and second light-transmissive portions or apertures for allowing the light to pass. The optical MEMS device can be a shutter for selectively affecting the flow of light through the package. A plurality of optical MEMS devices may be located within a single package because the optical paths for the MEMS devices can be substantially parallel to each other.

Abstract: Light-Transmissive Substrate for an Optical MEMS Device. According to one embodiment of the present invention, an optical device is provided. The optical device includes a substrate having an aperture for providing a pathway for light transmission and a device attached to a surface of the substrate for interacting with light transmitted along the pathway. According to another embodiment of the present invention, an optical device is provided which includes a substrate manufactured of a light-transmissive material having surfaces coated with an anti-reflective material for providing a pathway for light transmission and a device attached to a surface of the substrate for interacting with light transmitted along the pathway.

Abstract: An across-wafer optical MEMS device includes a protective lid having across-wafer light-transmissive portions. The across-wafer optical MEMS device allows light to pass in a direction substantially parallel to a surface on which the optical MEMS device is mounted. The light-transmissive portions in the protective lid allow light to pass from an optical device located on one side of the optical MEMS device to a second device located on another side of the optical MEMS device. A plurality of optical MEMS devices can be located on the substrate and enclosed by the same lid without wafer-level encapsulation of each optical MEMS device.