Patents by Inventor Dandan Lyu

Dandan Lyu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240174906
    Abstract: A thermally-conductive phase-change composition is described that includes a polyfunctional group modified polysiloxane as a base polymer and a thermally-conductive filler, wherein the polyfunctional group modified polysiloxane can be a polysiloxane modified by a polyether functional group and a functional group having antioxidant properties. Also described, is a thermally-conductive phase-change product obtained from the composition.
    Type: Application
    Filed: March 21, 2022
    Publication date: May 30, 2024
    Inventors: Kui TAN, Yuxia LYU, Dandan HE, Chaobo WU
  • Publication number: 20240165123
    Abstract: The present application provides use of Compound (I), an optical isomer thereof or a pharmaceutically acceptable salt thereof in manufacture of a medicament useful in treating a disease related to high expression or abnormal activation of JAK and SYK kinases, comprising an autoimmune disease, such as an immune-mediated skin disease, in particular psoriasis, atopic dermatitis and SLE. Compound (I), an optical isomer thereof or a pharmaceutically acceptable salt thereof according to the present invention can improve the skin lesions in mice with psoriasis, atopic dermatitis and SLE, alleviate the injury of kidney, inhibit the expansion of immune organs, reduce the level of inflammation, inhibit the increase of SLE related antibodies and cytokines in serum, and has a certain safe therapeutic window, which has a good clinical application prospect.
    Type: Application
    Filed: March 9, 2022
    Publication date: May 23, 2024
    Applicants: CSPC Zhongqi Pharmaceutical Technology (Shijiazhuang) Co., Ltd., Hangzhou Innogate Pharma Co., Ltd, CSPC Ouyi Pharmaceutical Co., Ltd
    Inventors: Hanyu YANG, Hancheng ZHANG, Xibao LIU, Congcong CAI, Ning QIN, Mo DAN, Lu LYU, Dandan ZHANG, Jieru LIU
  • Publication number: 20230250983
    Abstract: The present disclosure provides an air conditioner defrosting control method and device, and a storage medium and an air conditioner. The control method includes: setting a target discharge temperature of a compressor and an initial opening degree of a throttle device when an air conditioner performs defrosting according to an outdoor ambient temperature when the air conditioner meets a defrosting condition and enters a defrosting mode; controlling a defrosting operation of the air conditioner according to the target discharge temperature of the compressor and the initial opening degree of the throttle device; and controlling the air conditioner to exit the defrosting mode when a temperature of an outdoor heart exchanger of the air conditioner reaches a set temperature value.
    Type: Application
    Filed: March 17, 2021
    Publication date: August 10, 2023
    Inventors: Zhiqiang Li, Dandan Lyu, Jiancheng Li, Yulong Liang, Weishuang Liu, Qiuyu Zhang, Ping Wang
  • Patent number: 11720726
    Abstract: A global computer aided engineering (CAE) model representing an electronic product that contains solder joints and an individual detailed solder joint model are received. The solder joint model can include a solder ball, one or more metal pads, a portion of printed circuit board, and a portion of semiconductor chip component. The global CAE model includes locations of the solder joints to be evaluated in a drop test simulation. The solder joint model is replicated at each location to create a local CAE model via a geometric relationship between the global CAE model and the local CAE model. Simulated physical behaviors of the product under a design condition are obtained in a co-simulation using the global CAE model in a first time scale and the local CAE model in a second time scale. Simulated physical behaviors are periodically synchronized based on kinematic and force constraints.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: August 8, 2023
    Assignee: ANSYS Inc.
    Inventors: Cheng-Tang Wu, Wei Hu, Dandan Lyu, Siddharth Shah, Ashutosh Srivastava