Patents by Inventor Dandan Shi

Dandan Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12240811
    Abstract: Provided is a compound of formula I or II, a stereoisomer, a tautomer, a geometrical isomer, a solvate, an active metabolite, a hydrate, a prodrug or a pharmaceutically acceptable salt thereof, a pharmaceutical composition thereof, and the medical uses thereof in treating diseases benefiting from the capsid protein assembly inhibitor, particularly diseases caused by hepatitis B virus infection.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: March 4, 2025
    Assignee: CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD.
    Inventors: Yinsheng Zhang, Wangwei Ao, Yuan Li, Hui Wang, Hangzhou Shen, Jie Ni, Huan Zhang, Jie Wu, Li Zhang, Kai Cao, Peng Lu, Xushi Liu, Jie Wang, Tianxiao Zhao, Xingfeng Ge, Dandan Lu, Shuo Chen, Xueqin Ma, Wei Shi, Xiaojin Wang, Hongjiang Xu
  • Patent number: 12240841
    Abstract: An FXR small molecule agonist and a preparation method therefor and a use thereof, having a structure as shown in formula (I). The compound represented by formula (I) has FXR agonistic activity and is capable of preparing drugs for treatment of FXR-related diseases.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: March 4, 2025
    Assignees: SHANGHAI INSTITUTE OF MATERIA MEDICA, CHINESE ACADEMY OF SCIENCES, VAN ANDEL RESEARCH INSTITUTE
    Inventors: Huaqiang Xu, Jia Li, Jingjing Shi, Yi Zang, Dandan Sun, Mingliang Liu, Rongrong Xie, Erli You, Lixin Gao, Qian Tan
  • Patent number: 12215358
    Abstract: Provided is a Coxsackievirus A6 (CVA6) strain CVA6-KM-J33 and use thereof, and belongs to the technical field of biomedicine. The present invention provides a CVA6 strain CVA6-KM-J33, which belongs to a CVA6 virus. In the present invention, the strain CVA6-KM-J33 is susceptible to KMB17 cells and can achieve a relatively high titer. The strain has strong virulence, high pathogenicity and lethality to suckling mice, and desirable immunogenicity, and is a highly effective virus strain for CVA6 vaccine development. This strain can be used for immunogenicity evaluation or protective evaluation of CVA6 vaccine to improve the accuracy and reproducibility of vaccine immunogenicity evaluation. This strain can also be used to prepare animal models of Coxsackievirus (CV) infection, and exhibits desirable application prospects.
    Type: Grant
    Filed: May 3, 2024
    Date of Patent: February 4, 2025
    Assignee: INSTITUTE OF MEDICAL BIOLOGY, CAMS
    Inventors: Longding Liu, Li Yu, Guorun Jiang, Dandan Li, Heng Zhao, Huiwen Zheng, Ying Zhang, Yun Liao, Haijing Shi, Xin Zhao, Heng Li
  • Patent number: 11979121
    Abstract: A sense amplifier circuit includes: a charge module configured to charge a set signal node and a reset signal node according to a clock signal; and a sense module configured to sense and amplify a differential input signal according to the clock signal; where, the sense module includes a first amplification circuit, a second amplification circuit, and a cross hopping transfer circuit cross-connected between the first amplification circuit and the second amplification circuit. The cross hopping transfer circuit is configured to transfer a valid signal of a newly started amplification circuit to another amplification circuit if sensing is completed and the differential input signal hops, such that a set signal/reset signal remains unchanged. A flip-flop includes the sense amplifier circuit.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: May 7, 2024
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Dandan Shi, Qifan Gong
  • Publication number: 20240014789
    Abstract: The present disclosure provides a sense amplifier circuit and a flip-flop. The sense amplifier circuit includes: a charge module configured to charge a set signal node and a reset signal node according to a clock signal; and a sense module configured to sense and amplify a differential input signal according to the clock signal; where, the sense module includes a first amplification circuit, a second amplification circuit, and a cross hopping transfer circuit cross-connected between the first amplification circuit and the second amplification circuit. The cross hopping transfer circuit is configured to transfer a valid signal of a newly started amplification circuit to another amplification circuit if sensing is completed and the differential input signal hops, such that a set signal/reset signal remains unchanged.
    Type: Application
    Filed: January 10, 2023
    Publication date: January 11, 2024
    Inventors: Dandan SHI, Qifan Gong
  • Patent number: 11081408
    Abstract: Aspects of the disclosure provide a method for wafer warpage control. The method includes forming a filling structure in a slit opening on a wafer. Further, the method includes measuring a warpage parameter of the wafer, and determining a thermal profile to adjust a warpage parameter into a target range based on the warpage parameter. Then, the method includes performing a process having the determined thermal profile to adjust the warpage parameter into the target range.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: August 3, 2021
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Dandan Shi, Ming Hu, Shijin Luo, Zhiliang Xia, Zhi Zhang
  • Publication number: 20210111079
    Abstract: Aspects of the disclosure provide a method for wafer warpage control. The method includes forming a filling structure in a slit opening on a wafer. Further, the method includes measuring a warpage parameter of the wafer, and determining a thermal profile to adjust a warpage parameter into a target range based on the warpage parameter. Then, the method includes performing a process having the determined thermal profile to adjust the warpage parameter into the target range.
    Type: Application
    Filed: January 8, 2020
    Publication date: April 15, 2021
    Applicant: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Dandan Shi, Ming Hu, Shijin Luo, Zhiliang Xia, Zhi Zhang