Abstract: Ionic fluid mixtures are described that include an ionic liquid and a solid-phase material. The ionic liquid and the solid-phase material are selected to convert the solid-phase material into a gas phase material at a temperature that is lower than a conversion of the ionic liquid into a gas phase ionic material. In addition, methods of supplying a gaseous precursor to an application are described. These methods include providing a mixture of an ionic liquid and a solid-phase starting material, heating the mixture to a temperature that vaporizes at least a portion of the solid-phase starting material into the gaseous precursor, and transporting the gaseous precursor from the mixture to the application that utilizes the gaseous precursor.

Abstract: A modular fluid handling system is disclosed and may include a plurality of fluid handling units. Adjacent fluid handling units may be coupled together to form the fluid handling system. The fluid handling system may deliver fluid from at least one fluid source to fluid utilizing equipment. A plurality of fluid passages may be formed from the coupled plurality of fluid handling units, where the diameter of at least one fluid passage may be greater than the diameter of at least one other fluid passage.

Abstract: A fluid handling unit is disclosed and includes a body, a plurality of fluid passage ports formed in the body, and a plurality of orifices formed on surfaces of the body to provide fluid access to the ports from outside the unit. At least two of the orifices may have different cross-sectional areas. A modular fluid handling system is also disclosed and includes a plurality of fluid handling units, wherein adjacent fluid handling units are coupled together to form the fluid handling system. The fluid handling system may deliver fluid from at least one fluid source to fluid utilizing equipment. A plurality of fluid passages may be formed by the fluid handling units, and the diameter of one fluid passage may be greater than the diameter of another fluid passage. At least one control component may be coupled with at least one fluid handling unit.

Abstract: A chemical vapor deposition (CVD) reactor for growing epitaxial layers on wafers includes a chamber having an interior region and exterior region. The chamber includes one or more apertures extending therethrough for passing reactant gases from the exterior region of the chamber to the interior region of the chamber. The CVD reactor also includes one or more reactant gas injectors which are releasably secured to the one or more apertures in the chamber. Each reactant gas injector includes one or more passageways for passing reactant gas through the apertures in the chamber and into the interior region of the chamber. At least one of the injectors is releasably secured to the apertures so that the injector(s) may be removed from the aperture(s) of the chamber without entering the interior region of the chamber.

Abstract: A liquid vaporizer apparatus and method for chemical vapor deposition of liquid solutions into a controlled atmosphere of a CVD reaction chamber. The apparatus comprises an atomizer, gas curtain, heated porous media disks and a carrier gas mixer. The invention provides for the independent control of temperature, pressure and precursor stoichiometry during the atomizing and vaporization process thereby rendering the precise precursor vapor quality and quantity required for a given application. The invention employs the use of removable porous media disks which may be varied according to the desired operating pressure and precursors. In operation, the apparatus provides for a liquid precursor to first be atomized into a mist using an ultrasonic nozzle, then vaporized by heated media disks, and mixed with a carrier gas, then forced into CVD reaction chamber.

Abstract: A liquid vaporizer apparatus and method for chemical vapor deposition of liquid solutions into a controlled atmosphere of a CVD reaction chamber. The apparatus comprises an atomizer, gas curtain, heated porous media disks and a carrier gas mixer. The invention provides for the independent control of temperature, pressure and precursor stoichiometry during the atomizing and vaporization process thereby rendering the precise precursor vapor quality and quantity required for a given application. The invention employs the use of removable porous media disks which may be varied according to the desired operating pressure and precursors. In operation, the apparatus provides for a liquid precursor to first be atomized into a mist using an ultrasonic nozzle, then vaporized by heated media disks, and mixed with a carrier gas, then forced into CVD reaction chamber.

Abstract: A die paste transfer system wherein a first layer of bonding paste is transfer to a surface of the die as the die moves through the paste station in a controlled manner. The control for the transport controls orientation which the die passes through the paste station and the orientation of the die at the bonding site. The height of the die is varied as it passes through a second layer of paste. The speed at which the die and the second layer of bonding paste move well to each other is also adjusted to produce the desired thickness of the first layer on the die. Shear is produced in the second layer to affect transfer of the bonding paste from the reservoir to the die. For larger dies, the die may enter and leave the paste more than once to produce individual plateaus spaced from the edge of the die.

Abstract: A die paste transfer system wherein a first layer of bonding paste is transfer to a surface of the die as the die moves through the paste station in a controlled manner. The control for the transport controls orientation which the die passes through the paste station and the orientation of the die at the bonding site. The height of the die is varied as it passes through a second layer of paste. The speed at which the die and the second layer of bonding paste move well to each other is also adjusted to produce the desired thickness of the first layer on the die. Shear is produced in the second layer to affect transfer of the bonding paste from the reservoir to the die. For larger dies, the die may enter and leave the paste more than once to produce individual plateaus spaced from the edge of the die.