Patents by Inventor Dane Thompson

Dane Thompson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer electronic component systems and methods of manufacture
    Patent number: 7834808
    Abstract: Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: November 16, 2010
    Assignee: Georgia Tech Research Corporation
    Inventors: Dane Thompson, Guoan Wang, Nickolas D. Kingsley, Ioannis Papapolymerou, Emmanouil M. Tentzeris, Ramanan Bairavasubramanian, Gerald DeJean, RongLin Li
  • Packaging Systems Incorporating Thin Film Liquid Crystal Polymer (LCP) and Methods of Manufacture
    Publication number: 20100201003
    Abstract: Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first electronic component.
    Type: Application
    Filed: November 23, 2005
    Publication date: August 12, 2010
    Inventors: Dane Thompson, Guoan Wang, Nickolas D. Kingsley, Ioannis Papapolymerou, Emmanouil M. Tentzeris
  • MULTILAYER ELECTRONIC COMPONENT SYSTEMS AND METHODS OF MANUFACTURE
    Publication number: 20100090902
    Abstract: Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.
    Type: Application
    Filed: November 23, 2005
    Publication date: April 15, 2010
    Inventors: Dane Thompson, Guoan Wang, Nickolas D. Kingsley, Ioannis Papapolumerou, Emmanouil M. Tentzeris, Ramanan Bairavasubramanian 1, Gerald DeJean, RongLin Li