Patents by Inventor Danel Alexander Steigerwald

Danel Alexander Steigerwald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED having vertical contacts redistruted for flip chip mounting
    Patent number: 9246061
    Abstract: A light emitting diode (LED) structure has semiconductor layers, including a p-type layer, an active layer, and an n-Type layer. The p-type layer has a bottom surface, and the n-type layer has a top surface though which light is emitted. A copper layer has a first portion electrically connected to and opposing the bottom surface of the p-type layer. A dielectric wall extends through the copper layer to isolate a second portion of the copper layer from the first portion. A metal shunt electrically connects the second portion of the copper layer to the top surface of the n-type layer. P-metal electrodes electrically connect to the first portion, and n-metal electrodes electrically connect to the second portion, wherein the LED structure forms a flip chip. Other embodiments of the methods and structures are also described.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: January 26, 2016
    Assignee: Koninklijke Philips N.V.
    Inventors: Jipu Lei, Kwong-Hin Henry Choy, Yajun Wei, Stefano Schiaffino, Danel Alexander Steigerwald
  • LED HAVING VERTICAL CONTACTS REDISTRUTED FOR FLIP CHIP MOUNTING
    Publication number: 20130334563
    Abstract: A light emitting diode (LED) structure has semiconductor layers, including a p-type layer, an active layer, and an n-Type layer. The p-type layer has a bottom surface, and the n-type layer has a top surface though which light is emitted. A copper layer has a first portion electrically connected to and opposing the bottom surface of the p-type layer. A dielectric wall extends through the copper layer to isolate a second portion of the copper layer from the first portion. A metal shunt electrically connects the second portion of the copper layer to the top surface of the n-type layer. P-metal electrodes electrically connect to the first portion, and n-metal electrodes electrically connect to the second portion, wherein the LED structure forms a flip chip. Other embodiments of the methods and structures are also described.
    Type: Application
    Filed: February 28, 2012
    Publication date: December 19, 2013
    Applicant: KONINKLIJKE PHILIPS N.V.
    Inventors: Jipu Lei, Kwong-Hin Henry Choy, Yajun Wei, Stefano Schiaffino, Danel Alexander Steigerwald