Patents by Inventor Dangji Song

Dangji Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite epoxy resin board and forming method thereof
    Patent number: 10214920
    Abstract: A composite epoxy resin board, made from a raw material which includes the following weight percentage of components: waste prepreg powders of 5% to 100%, and waste printed circuit board (PCB) powders of 0% to 95%, is disclosed. The present invention adopts the waste prepregs as the main preparation raw material, which not only recycles and reuses prepreg scraps, but also reduces or even eliminates the use of adhesives due to the high epoxy resin content in the prepregs, while also reducing the glue-mixing time in the forming process, thereby simplifying the forming technology.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: February 26, 2019
    Assignee: GUANGDONG OUMING NEW MATERIAL TECHNOLOGY CO., LTD
    Inventor: Dangji Song
  • Composite Epoxy Resin Board and Forming Method Thereof
    Publication number: 20170298639
    Abstract: A composite epoxy resin board, made from a raw material which includes the following weight percentage of components: waste prepreg powders of 5% to 100%, and waste printed circuit board (PCB) powders of 0% to 95%, is disclosed. The present invention adopts the waste prepregs as the main preparation raw material, which not only recycles and reuses prepreg scraps, but also reduces or even eliminates the use of adhesives due to the high epoxy resin content in the prepregs, while also reducing the glue-mixing time in the forming process, thereby simplifying the forming technology.
    Type: Application
    Filed: June 26, 2017
    Publication date: October 19, 2017
    Inventor: Dangji Song