Abstract: Invented is a method and system for wet processing substrates (especially for semiconductor wafers and flat panel displays) using nebulized chemicals created and carried by heated chemical gases. Different heated nebulized process chemicals are sequentially pressurized into a process chamber based on various process recipes. The micro nebulized chemicals would penetrate the intricate topologies on the substrates with heated and pressurized energy, and form a process effective thin film on each substrate. The process chamber is made of a material that is well compatible to all process chemicals and gases. It is designed to have the capability of circulating the flow of nebulized chemicals and gases to uniformly treat the inside substrates. The chamber is also designed having minimum open space to save process chemicals and deionized (DI) water.