Patents by Inventor Dani I Smith

Dani I Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transistor structures
    Patent number: 6709937
    Abstract: The invention encompasses a method of forming an insulative material along a conductive structure. A conductive structure is provided over a substrate, and an electrically insulative material is formed along at least a portion of the conductive structure. The electrically insulative material comprises at least one of SixOyNz and AlpOq, wherein p, q, x, y and z are greater than 0 and less than 10. A dopant barrier layer is formed over the electrically insulative material. BPSG is formed over the dopant barrier layer, and the dopant barrier layer prevents dopant migration from the BPSG to the electrically insulative material. The invention also encompasses transistor structures, and methods of forming transistor structures.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: March 23, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Jeffrey W. Honeycutt, Hassan Shahjamali, Dani I Smith