Patents by Inventor Danian Dong

Danian Dong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12260911
    Abstract: The memory circuit structure includes: a storage array, wherein the storage array includes at least two storage units; a decoder connected with a bit line and a word line of the storage array respectively; a programming circuit configured to generate a voltage pulse or a constant current pulse; a polarity switching circuit connected with the programming circuit, and configured to implement a switching between a voltage programming and a current programming of the programming circuit under a set operation and a reset operation; a detection circuit connected with the storage array, and configured to detect a detection signal of a current or a voltage corresponding to the specific storage unit in the storage array and feed back the detection signal to a control unit, wherein the detection signal output by the detection circuit is configured to enable the polarity switching circuit to switch; and the control unit.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: March 25, 2025
    Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Xiaoxin Xu, Jie Yu, Danian Dong, Zhaoan Yu, Hangbing Lv
  • Publication number: 20240260488
    Abstract: A method for manufacturing a reservoir computing apparatus, related to artificial intelligence. The method comprises: step a), providing a bottom electrode layer, a dielectric layer, a resistive switching layer, and a top electrode layer based on the above-listed sequence on a substrate to obtain a to-be-annealed reservoir computing apparatus; and step b), annealing the to-be-annealed reservoir computing apparatus to obtain the reservoir computing apparatus, where a temperature of the annealing ranges from 300° C. to 700° C., and duration of the annealing duration ranges from 30s to 100s. The manufactured reservoir computing apparatus is subject to rapid annealing, which redistributes defects, forms a more stable film, and introduces a ferroelectric O-phase into the film. The rapid annealing reduces power consumption and improves computing accuracy effectively.
    Type: Application
    Filed: March 15, 2022
    Publication date: August 1, 2024
    Inventors: Xiaoxin XU, Wenxuan SUN, Jie YU, Jinru LAI, Xu ZHENG, Danian DONG
  • Publication number: 20240130251
    Abstract: A three-dimensional reservoir based on three-dimensional volatile memristors and a method for manufacturing the same. In the three-dimensional reservoir, a memory layer, a select layer, and an electrode layer in each via form a memristor which is a reservoir unit. The three-dimensional reservoir is formed based on a stacking structure and multiple vias. The three-dimensional reservoir is constructed by using virtual nodes generated from dynamic characteristics of the three-dimensional memristors. An interfacial memristor is first constructed, and its volatility is verified through electric tests. A vertical three-dimensional array is manufactured based on the volatile memristor. A dynamic characteristic of the memristor is adjusted through a Schottky barrier. Different layers in the three-dimensional reservoir correspond to different reservoirs, which are constructed by controlling memristors in the different layers, respectively.
    Type: Application
    Filed: March 10, 2022
    Publication date: April 18, 2024
    Inventors: Xiaoxin XU, Wenxuan SUN, Jie YU, Woyu ZHANG, Danian DONG, Jinru LAI, Xu ZHENG, Dashan SHANG
  • Publication number: 20240023469
    Abstract: The present disclosure provides a resistive random access memory and a method of preparing the same. The resistive random access memory includes: a resistive layer, an upper electrode and a barrier structure. The resistive layer is arranged on a substrate; the upper electrode is arranged on the resistive layer; and the barrier structure is arranged between the resistive layer and the upper electrode, and the barrier structure is configured for electrons to pass through a conduction band of the barrier structure when a device performs an erasing operation, so as to avoid forming of a defect in the resistive layer and causing a reverse breakdown of the resistive layer.
    Type: Application
    Filed: December 14, 2020
    Publication date: January 18, 2024
    Inventors: Xiaoxin XU, Xiaoyan LI, Danian DONG, Jie YU, Hangbing LV
  • Publication number: 20230368838
    Abstract: The memory circuit structure includes: a storage array, wherein the storage array includes at least two storage units; a decoder connected with a bit line and a word line of the storage array respectively; a programming circuit configured to generate a voltage pulse or a constant current pulse; a polarity switching circuit connected with the programming circuit, and configured to implement a switching between a voltage programming and a current programming of the programming circuit under a set operation and a reset operation; a detection circuit connected with the storage array, and configured to detect a detection signal of a current or a voltage corresponding to the specific storage unit in the storage array and feed back the detection signal to a control unit, wherein the detection signal output by the detection circuit is configured to enable the polarity switching circuit to switch; and the control unit.
    Type: Application
    Filed: January 25, 2021
    Publication date: November 16, 2023
    Inventors: Xiaoxin Xu, Jie Yu, Danian Dong, Zhaoan Yu, Hangbing Lv