Abstract: An improved semiconductor package is disclosed wherein a semiconductor wafer assembly includes first and second generally planar surfaces having respective first and second membrane members in overlying relationship thereto. Encompassing the periphery of the wafer assembly is a mass of retaining material, such as epoxy resin, which may overlie outer edge portions of the wafer assembly and sealingly engage the first and second membrane members. In a preferred embodiment, the semiconductor wafer assembly comprises a thyristor having a gate associated therewith having conductor means attached thereto which are embedded in a suitable layer of adhesive material which is disposed between the wafer assembly and the mass of retaining material. Another feature of the invention includes the provision of a temperature sensing element, such as a thermistor, which is disposed in intimate heat exchange relationship to the wafer assembly so as to accurately sense its operating temperature.

Abstract: A solid state starter for a chiller compressor motor mounts directly on the compressor motor and comprises a bank of SCR's which are controllably switched to conduct current to the motor for starting and running. Electronic control modules are provided including a trigger module for triggering the SCR's, a current module (including current overload protection) for controlling the trigger module so that motor current is controllably delivered to the motor, and a voltage safety module for protecting against electrical faults. The SCR's are cooled by liquid refrigerant.