Patents by Inventor Daniel A. DiLeo

Daniel A. DiLeo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a microelectronic device utilizing unfilled epoxy adhesive
    Patent number: 4209358
    Abstract: A method of bonding microelectronic components (10, 23, 24) is disclosed. A light emitting diode (10) is bonded to a conductive lead (24) and/or a portion of a lead frame (23) using an adhesive having no metallic particles therein. The diode (10) is clamped to the conductive lead (24) and/or the lead frame (23) as the epoxy is cured. Such bonds have been found to exhibit low contact resistance in addition to long life and reliability.
    Type: Grant
    Filed: December 4, 1978
    Date of Patent: June 24, 1980
    Assignee: Western Electric Company, Incorporated
    Inventors: Daniel A. DiLeo, Samuel E. Kurtz, John J. Svitak