Abstract: Cooling of an information handling system can be provided liquid-assisted cooling apparatus with liquid. The liquid-assisted cooling apparatus may comprise a drip tray component positioned under a liquid-assisted cooling module having a cooling block, a heat exchanger, and piping connecting the cooling block and heat exchanger. The drip tray can collect fluid leaked by or from the liquid-assisted cooling module. The drip tray may include an absorbent material to contain the leaked fluid and/or a liquid sensor to detect the presence of fluid in the drip tray. The liquid sensor may be coupled to a controller configured to adjust operation of one or more electronic components cooled by the liquid-assisted cooling apparatus when fluid is determined to be present in the drip tray.

Abstract: Cooling of an information handling system can be provided liquid-assisted cooling apparatus with liquid. The liquid-assisted cooling apparatus may comprise a drip tray component positioned under a liquid-assisted cooling module having a cooling block, a heat exchanger, and piping connecting the cooling block and heat exchanger. The drip tray can collect fluid leaked by or from the liquid-assisted cooling module. The drip tray may include an absorbent material to contain the leaked fluid and/or a liquid sensor to detect the presence of fluid in the drip tray. The liquid sensor may be coupled to a controller configured to adjust operation of one or more electronic components cooled by the liquid-assisted cooling apparatus when fluid is determined to be present in the drip tray.

Abstract: A power measurement transducer includes a first surface configured to thermally couple the power measurement transducer to a device under test. A second surface is essentially parallel to and spaced apart from the first surface. Two or more temperature measurement elements are positioned between the first and second surfaces. The power measurement transducer is configured to allow at least a portion of the power generated within the device under test to enter the power measurement transducer through the first surface and exit the power measurement transducer through the second surface.

Abstract: A method of determining thermal output of a device under test includes attaching a power measurement transducer to a device under test, wherein the power measurement transducer includes two or more temperature measurement elements. A test sequence is applied to the device under test. One or more signals produced by the power measurement transducer are monitored to determine a quantity of power produced by the device under test during the test sequence.

Abstract: A power measurement transducer includes a thermally conductive heat spreading device having a first surface configured to thermally couple the power measurement transducer to a device under test. Two or more temperature measurement elements are positioned within the thermally conductive heat spreading device.

Abstract: A multi-pin probe including a printed circuit board with multiple electrically conductive vias, multiple probes, each probe inserted into one of the electrically conductive vias, and a housing having multiple cavities inserted over the multiple probes, each cavity having a first and a second aperture around one of the probes, the first aperture being smaller than the second aperture. In addition, a method of manufacturing a multi-pin probe including the steps of manufacturing a printed circuit board with multiple electrically conductive vias, inserting multiple probes into the electrically conductive vias, and inserting a housing having multiple cavities over the multiple probes, each cavity having a first and a second aperture around one of the probes, the first aperture being smaller than the second aperture.