Abstract: The invention is a device and method for electroplating a metal workpiece having axial symmetry, such as a circular workpiece. In this invention the workpiece, which is the cathode, is rotated inside an anode structure submerged in the plating solution. Part of the rotating cathode continuously moves through a region of intense current fluxes created by passing DC current between the anode and cathode. The rotating cathode stirs the plating solution, which speeds up the plating rate. At the same time, with only part of the cathode passing continuously through the intense current flux region, the deposition process is periodically slowed down and intensified.