Abstract: A hydraulic solenoid assembly for complex vehicle-borne control systems, such as automatic transmissions, includes a solenoid body or unitary housing operatively enclosing two or more solenoid valves. Each valve has a pressure port extending to an outer surface of the housing, emerging in a spaced-apart matrix. A metal (stainless steel or aluminum) sensor plate is mounted to the outer surface of the housing so as to sealingly overlay the pressure ports. A diaphragm is formed in the sensor plate for each solenoid valve and registers with its associated pressure port. Electrical components, such as thick file resistors arranged in a Wheatstone bridge network are printed or mounted to an outer surface of each diaphragm. The bridge networks are electrically connected to a control circuit and function to output signals as a function of hydraulic pressure induced displacement of the associated diaphragm.

Abstract: An enclosure for electronic circuitry is provided which has a first housing member having at least one protrusion formed in a wall and a second housing member having at least one slot for receiving the at least one protrusion and securing the second housing member to the first housing member. The second housing member and the first housing member have one or more continuous electrical ground contact surfaces. The second housing member is secured to the first housing member so that there is an interference fit between the at least one protrusion and at least one slot and so that there are one or more continuous electrical ground contact surfaces between the first housing member and the second housing member. A method of assembling an enclosure for electronic circuitry is provided.

Abstract: A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic component on a surface of the circuit board so that solder bumps on the bottom of the electronic component engage contact pads on the top of the circuit board. The solder bumps are then reflowed to attach the electronic component to the circuit board after which the electronic component is underfilled by providing a mold die having a mold cavity, a gate leading into the mold cavity and a vent leading out of the mold cavity. The mold die is placed over the electronic component and onto the surface of the circuit board so that the electronic component is inside the mold cavity and the mold cavity is sealed.

Abstract: An enclosure for electronic circuitry is provided which has a first housing member having at least one protrusion formed in a wall and a second housing member having at least one slot for receiving the at least one protrusion and securing the second housing member to the first housing member. The second housing member and the first housing member have one or more continuous electrical ground contact surfaces. The second housing member is secured to the first housing member so that there is an interference fit between the at least one protrusion and at least one slot and so that there are one or more continuous electrical ground contact surfaces between the first housing member and the second housing member. A method of assembling an enclosure for electronic circuitry is provided.

Abstract: An assembly for a sealed electronic component includes at least one electronic device mounted on a substrate, and a metal enclosure comprising first and second housing components that are welded together to define a sealed enclosure. The resulting assembly provides a reliable seal that eliminates the need for mechanical fasteners, adhesives, and equipment for applying and curing adhesives.

Abstract: A device for enclosing electronics and providing an electrical connection to the enclosed electronics is provided. The device includes a housing having alignment and barrier features, and a circuit board having alignment features and plated through-holes. The circuit board is coupled to the housing such that the alignment features of the circuit board and housing are aligned, and such that the barrier features of the housing are located adjacent the plated through-holes. The device further includes an epoxy material that at least partially coats the surfaces of the housing and circuit board. The barrier features separate the plated through-holes from the epoxy material, such that the epoxy material is not in contact with the interior surface of the plated through-holes. A method for enclosing electronics and providing an electrical connection to the enclosed electronics is also provided.

Abstract: A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic component on a surface of the circuit board so that solder bumps on the bottom of the electronic component engage contact pads on the top of the circuit board. The solder bumps are then reflowed to attach the electronic component to the circuit board after which the electronic component is underfilled by providing a mold die having a mold cavity, a gate leading into the mold cavity and a vent leading out of the mold cavity. The mold die is placed over the electronic component and onto the surface of the circuit board so that the electronic component is inside the mold cavity and the mold cavity is sealed.

Abstract: A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the flip chip (12) when mounted to a flexible or rigid substrate (20). Heat is conducted from the flip chip (12) through upper and lower pedestals (26, 28) each of which includes a pliable pre-cured silicone adhesive pad (32, 36). The pre-cured silicon adhesive pads (32, 36) promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansion and movement between the flip chips (12). The housing portions (16, 18) form a housing (14) when assembled, with each housing portion (16, 18) including a configured edge (37, 41) that controls the travel of the pedestals (26, 28) toward each other, to thereby limit the pressure exerted on the flip chip (12) disposed therebetween.

Abstract: A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the flip chip (12) when mounted to a flexible or rigid substrate (20). Heat is conducted from the flip chip (12) through upper and lower pedestals (26, 28) each of which includes a pliable pre-cured silicone adhesive pad (32, 36). The pre-cured silicon adhesive pads (32, 36) promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansion and movement between the flip chips (12). The housing portions (16, 18) form a housing (14) when assembled, with each housing portion (16, 18) including a configured edge (37, 41) that controls the travel of the pedestals (26, 28) toward each other, to thereby limit the pressure exerted on the flip chip (12) disposed therebetween.

Abstract: A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an external device, thereby allowing the integration of different types of circuits in a single, fully enclosed, yet partitioned, housing.

Abstract: A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the flip chip (12) when mounted to a flexible or rigid substrate (20). Heat is conducted from the flip chip (12) through upper and lower pedestals (26, 28) each of which includes a pliable pre-cured silicone adhesive pad (32, 36). The pre-cured silicon adhesive pads (32, 36) promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansion and movement between the flip chips (12). The housing portions (16, 18) form a housing (14) when assembled, with each housing portion (16, 18) including a configured edge (37, 41) that controls the travel of the pedestals (26, 28) toward each other, to thereby limit the pressure exerted on the flip chip (12) disposed therebetween.

Abstract: A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the flip chip (12) when mounted to a flexible or rigid substrate (20). Heat is conducted from the flip chip (12) through upper and lower pedestals (26, 28) each of which includes a pliable pre-cured silicone adhesive pad (32, 36). The pre-cured silicon adhesive pads (32, 36) promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansion and movement between the flip chips (12). The housing portions (16, 18) form a housing (14) when assembled, with each housing portion (16, 18) including a configured edge (37, 41) that controls the travel of the pedestals (26, 28) toward each other, to thereby limit the pressure exerted on the flip chip (12) disposed therebetween.

Abstract: A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an external device, thereby allowing the integration of different types of circuits in a single, fully enclosed, yet partitioned, housing.

Abstract: The present invention discloses an apparatus for golf putting practice wherein the present invention is an insert having at least one regulation size golf hole disposed therein wherein the insert is complementarily sized and shaped to be inserted into the outlet opening of a conventional heating and ventilation air conditioning (HVAC) system as might occur in the floor of a home or office building replacing a standard vent register. The insert is sized to be removably secured internal of the HVAC outlet so that it can be easily inserted and removed therefrom.

Abstract: A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an external device, thereby allowing the integration of different types of circuits in a single, fully enclosed, yet partitioned, housing.

Abstract: Wire bondable connectors assembly 10 is provided, including a lead element 12 have a lead portion 14 and a carrier strip portion 16, a first coining area 20 and a second coining area 22 formed in the lead element 12, and a connector housing 18 molded to the lead portion 14, including a fence element 24 surrounding the first coining area 20. In this fashion, the carrier strip portion 16 may be separated from the lead portion 14 in the location of the second coining area 22 while leaving the lead portion 14 secure within the connector housing 18.

Abstract: The present invention discloses an apparatus for golf putting practice wherein the present invention is an insert having at least one regulation size golf hole disposed therein wherein the insert is complementarily sized and shaped to be inserted into the outlet opening of a conventional heating and ventilation air conditioning (HVAC) system as might occur in the floor of a home or office building replacing a standard vent register. The insert is sized to be removably secured internal of the HVAC outlet so that it can be easily inserted and removed therefrom.

Abstract: A high density wirebond connector assembly (10), is provided including an enclosure (12), a circuit board (14), a high density connector (16), a connector housing (18), and a plurality of pin contacts (20). Every two rows of pin contacts (20) merge onto a single shelf (22) to provide a high density contact surface (31). The circuit board (14) is comprised of a plurality of laminate layers (32) and rows of wirebond pads (34) positioned on the laminate layers (32). A plurality of wirebonds (36) run between individual pin contacts (20) and individual wirebond pads (34). By creating a high density contact surface (31) in combination with decreasing the distance between the wirebond pads (34) and the pin contacts (20), a smaller, lighter, cheaper, and vibrationally resistant high density connector assembly (10) is provided.

Abstract: An electronics assembly 10 is provided, including a base element 16 and a cover element 18. The base element 16 includes a perimeter mating groove 20 and the cover element 18 including a perimeter tongue element 26. A plurality of crush ribs 34 are formed into the perimeter tongue element 26 such that when the perimeter tongue element 26 is positioned within the perimeter mating groove 20 during assembly, the plurality of crush ribs 34 establish conductive contact between the base element 16 and the cover element 18.

Abstract: A pressure sensor connector (10) for use with a pressure sensor element (12) that includes a plurality of pressure sensor terminals (13). The pressure sensor connector (10) includes a housing (18), a plurality of connector terminals (20) and a flexible circuit (22). A plurality of electrical pathways (24), formed on the flexible circuit (22), connect each of the plurality of connector terminals (20) to a corresponding pressure sensor terminal (13).