Abstract: A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.

Abstract: A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.

Abstract: A monolithic oscillating heat pipe (OHP) device comprising a monolithic body and an oscillating heat pipe (OHP) circuit integrally formed within the body. The OHP circuit is structured and operable to isothermally spread throughout the body heat from a heat source disposed on a heat source portion of the body and in thermally conductive contact with a portion of the OHP circuit. The monolithic OHP device further comprising a pumped fluid (PF) circuit integrally formed within the body and in thermally conductive contact with at least portion of the OHP circuit internally within the body. The PF circuit is structured and operable to remove heat from the portion of the OHP circuit in which the PF circuit is in thermally conductive contact with.

Abstract: An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.

Abstract: A vapor chamber structure which locks the upper planar plate lid to the lower planar plate base without the need for brazing and prevents distortion of the surfaces from internal pressure in the chamber. The basic structure has parallel rows of latching structures on the interior surfaces of the upper planar plate lid and the lower planar plate base. Each row of latching structures has a cross section in the shape the letter “L” with the top of the “L” attached to the interior surface of the lid so that the horizontal sections of the “L”s face the lower planar base plate when the chamber is assembled.