Abstract: An outer space deployable antenna may include a waveguide antenna feed section. A first plurality of wires and a first plurality of biased hinges may couple the first plurality of wires together to be self-biased to move between a collapsed stored configuration and an extended deployed configuration. A horn antenna section may be coupled to the waveguide antenna feed section and may include a second plurality of wires and a second plurality of biased hinges coupling the second plurality of wires together to be self-biased to move between the collapsed stored configuration and the extended deployed configuration. A flexible electrically conductive layer may cover the waveguide antenna feed section and the horn antenna section in at least the extended deployed configuration.

Abstract: An outer space deployable antenna may include a waveguide antenna feed section. A first plurality of wires and a first plurality of biased hinges may couple the first plurality of wires together to be self-biased to move between a collapsed stored configuration and an extended deployed configuration. A horn antenna section may be coupled to the waveguide antenna feed section and may include a second plurality of wires and a second plurality of biased hinges coupling the second plurality of wires together to be self-biased to move between the collapsed stored configuration and the extended deployed configuration. A flexible electrically conductive layer may cover the waveguide antenna feed section and the horn antenna section in at least the extended deployed configuration.

Abstract: An outer space deployable antenna may include a waveguide antenna feed section. A first plurality of wires and a first plurality of biased hinges may couple the first plurality of wires together to be self-biased to move between a collapsed stored configuration and an extended deployed configuration. A horn antenna section may be coupled to the waveguide antenna feed section and may include a second plurality of wires and a second plurality of biased hinges coupling the second plurality of wires together to be self-biased to move between the collapsed stored configuration and the extended deployed configuration. A flexible electrically conductive layer may cover the waveguide antenna feed section and the horn antenna section in at least the extended deployed configuration.

Abstract: An outer space deployable antenna may include a waveguide antenna feed section. A first plurality of wires and a first plurality of biased hinges may couple the first plurality of wires together to be self-biased to move between a collapsed stored configuration and an extended deployed configuration. A horn antenna section may be coupled to the waveguide antenna feed section and may include a second plurality of wires and a second plurality of biased hinges coupling the second plurality of wires together to be self-biased to move between the collapsed stored configuration and the extended deployed configuration. A flexible electrically conductive layer may cover the waveguide antenna feed section and the horn antenna section in at least the extended deployed configuration.

Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.

Abstract: An improved distributed amplifier (200) includes an input transmission line (201) terminated with an input lead configured to accept an input signal and an output transmission line (202) terminated with an output lead configured to output an output signal. A number of parallel amplifier cells (204N) are connected to the input transmission line (201) and the output transmission line (202) that collectively amplify the input signal from the input lead to produce an amplified output signal at the output lead. A bypass switch (212, 300) is connected to the input and output transmission lines (201, 202). The bypass switch (212, 300) is operative to convert either the input transmission line (201, 301) or the output transmission line (202, 302) into a bypass line configured to bypass the parallel amplifier cells (204N) of the distributed amplifier (200) and provide a direct path between the input and output transmission lines (201, 202) to produce a bypassed output signal at the output lead.

Abstract: An improved distributed amplifier (200) includes an input transmission line (201) terminated with an input lead configured to accept an input signal and an output transmission line (202) terminated with an output lead configured to output an output signal. A number of parallel amplifier cells (204N) are connected to the input transmission line (201) and the output transmission line (202) that collectively amplify the input signal from the input lead to produce an amplified output signal at the output lead. A bypass switch (212, 300) is connected to the input and output transmission lines (201, 202). The bypass switch (212, 300) is operative to convert either the input transmission line (201, 301) or the output transmission line (202, 302) into a bypass line configured to bypass the parallel amplifier cells (204N) of the distributed amplifier (200) and provide a direct path between the input and output transmission lines (201, 202) to produce a bypassed output signal at the output lead.

Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.

Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.

Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.