Patents by Inventor Daniel Andreas Scherer

Daniel Andreas Scherer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through type furnace for substrates comprising a longitudinal slit
    Patent number: 9666460
    Abstract: A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: May 30, 2017
    Assignee: Besi Switzerland AG
    Inventors: Guido Suter, Kevin Domancich, Daniel Andreas Scherer, Reto Weibel
  • Through-Type Furnace For Substrates To Be Fitted With Components And Die Bonder
    Publication number: 20150136836
    Abstract: A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 21, 2015
    Inventors: Guido Suter, Kevin Domancich, Daniel Andreas Scherer, Reto Weibel