Patents by Inventor Daniel Anthony Scola

Daniel Anthony Scola has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board assembly with a substrate having a glass fabric reinforced, condensation reacted and thermally crosslinked nadic end-capped polyimide resin
    Patent number: 6268569
    Abstract: A high-performance printed wiring board assembly is disclosed which utilizes a substrate component having a reinforcement material. The substrate has a glass fabric reinforcement embedded in a condensation-reacted and thermally-crosslinked nadic end-capped polyimide resin. There are electrically conductive lamina current pathways directly adhered to the substrate. There are high-temperature soldered or metallurgically bonded connections that electrically join conductor leads of electrical devices to the lamina current pathways.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: July 31, 2001
    Assignee: National Center for Manufacturing Sciences
    Inventors: Daniel Anthony Scola, Richard Thomas Grannells
  • Printed wiring board assemblies
    Patent number: 5966804
    Abstract: A method of manufacturing a high-performance printed wiring board assembly, and the resulting product, utilize a substrate component that has a reinforcement material embedded in a condensation-reacted and thermally-crosslinked nadic end-capped polyimide resin electrically conductive lamina component pathways directly adhered to the substrate component resin and high-temperature soldered or otherwise attached connections that electrically join the conductor leads of included electrical devices to the lamina component conductive pathways.
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: October 19, 1999
    Assignee: National Center For Manufacturing Sciences
    Inventors: Daniel Anthony Scola, Richard Thomas Grannells