Abstract: Cooling device, comprising a housing with at least one cooling channel for a cooling liquid, and with at least one thermoelectric cooling element comprising a layer of semiconductor material that is sandwiched between two plates. At least one of the plates presents an electrically insulation contact surface that, in use, is in direct contact with the cooling liquid. The at least one cooling element is along its outer perimeter flexibly and sealingly framed in a carrier such that the contact surface remains free to contact the cooling liquid. The carrier and the contact surface define a wall portion of the cooling channel.