Patents by Inventor Daniel Arnzen

Daniel Arnzen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-planar packaging of image sensor
    Patent number: 7507944
    Abstract: A non-planar frame base for an image sensor.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: March 24, 2009
    Assignee: Cypress Semiconductor Corporation
    Inventors: Daniel Arnzen, Thurman John Rodgers
  • Plasma etching method
    Patent number: 6406640
    Abstract: The present invention relates to a method of plasma etching and a method of operating a plasma etching apparatus in which a concentration of oxygen at flash striking is greater than a concentration during etching.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: June 18, 2002
    Assignee: Cypress Semiconductor Corporation
    Inventors: Chan-lon Yang, Usha Raghuram, Kimberley A. Kaufman, Daniel Arnzen, James Nulty
  • Plasma etching method
    Patent number: 6165375
    Abstract: The present invention relates to a method of plasma etching and a method of operating a plasma etching apparatus.
    Type: Grant
    Filed: September 23, 1997
    Date of Patent: December 26, 2000
    Assignee: Cypress Semiconductor Corporation
    Inventors: Chan-lon Yang, Usha Raghuram, Kimberley A. Kaufman, Daniel Arnzen, James Nulty
  • Thin liner layer providing reduced via resistance
    Patent number: 6016012
    Abstract: The present invention relates to semiconductor device containing a via and a method of forming a via in a semiconductor device.
    Type: Grant
    Filed: November 5, 1996
    Date of Patent: January 18, 2000
    Assignee: Cypress Semiconductor Corporation
    Inventors: Ahmad Chatila, Kuantai Yeh, James M. Cleeves, Daniel Arnzen, Roger Caldwell