Abstract: An enclosure containing heat-producing equipment includes an air inlet for admitting air from an environment containing the enclosure. The equipment is situated relative to the air inlet such that the air absorbs heat from the equipment, increasing the temperature of the air. An air-to-liquid heat exchanger is mounted on an outside surface of the enclosure adjacent to an air outlet. The heat exchanger is connectable to an external cooling source such that heat from the heated air exiting the enclosure absorbed by the heat exchanger is expelled outside the environment containing the enclosure.

Abstract: A cooling apparatus and method, and more particularly, an apparatus and method for cooling the air exiting an electronics enclosure, are disclosed. Air is taken into the enclosure and heated by the electronic equipment. The air is then expelled through a heat exchanger, which cools the exiting air. The exiting air is cooled using an external source of cooling liquid, which absorbs the heat from the exiting air. This absorbed heat is then expelled from the liquid outside of the environment containing the enclosure. Cooling the air exiting the enclosure causes the enclosure to present a neutral heat load to a room containing such an enclosure. Cooling the exiting air obviates the necessity of increasing the room air conditioning capacity to account for the heat added to the room by the electronics within the enclosure.

Abstract: A cooling system for use in conjunction with electronic devices (such as a computer) is disclosed. The cooling system is composed of several segments that comprise a continuous thermal path from the heat producing electronic component to a primary fluid circuit. The system transfers the heat to a secondary fluid circuit. The primary circuit is sealed and allows the transfer of heat to the secondary circuit without the requirements of the secondary fluid being directly connected through hoses or other means to the electronic device.

Abstract: The present invention is directed to a cooling apparatus and method, and more particularly, an apparatus and method for cooling the air exiting an electronics enclosure. Cooling the air exiting the enclosure causes the enclosure to present a neutral heat load to a room containing such enclosure. Cooling the exiting air obviates the necessity of increasing the room air conditioning capacity to account for the heat added to the room by the electronics within the enclosure. Further, the invention decreases the possibility of moisture condensation within the enclosure and also provides a more efficient cooling system than is available from prior art devices and techniques.

Abstract: A redundant, dual circuit air conditioning apparatus is provided for communications enclosures which is wall mounted thereon. A conditioned air housing is provided having a blower chamber which contains two air circulation blowers thrusting air into the enclosure and having freely pivotal ducts which operate in mutual cooperation in response to pressure variations between the chamber and the enclosure. Internested evaporator coils of two discrete refrigeration circuits share common fin connections for efficiency and each includes a dual line input performing in conjunction with an expansion valve and a simple Y distribution fitting coupled to those lines which achieves requisite pressure drops at low cost.

Abstract: Disclosed is an improved air conditioning system of the type having a refrigerant which sequentially flows through compressor means, condenser means in heat exchange relationship with outdoor air, expansion means, and evaporator means for the direct or indirect cooling of air in a confined space for maintaining the confined air space at a desired set point of temperature and/or humidity. The improvement for maintaining said set point of temperature and/or humidity of the confined space at variable heat loads therein and at variable outdoor air temperature comprises variable speed compressor means responsive to varying outdoor air temperature for attenuating refrigerant mass flow corresponding to lower outdoor air temperature; and expansion means responsive to attenuated refrigerant mass flow for maintaining adequate refrigerant mass flow to the evaporator means for maintaining constant the desired set point of temperature and/or humidity of the confined space at varying outdoor air temperature.