Abstract: A connector assembly is provided. The connector assembly includes a receptacle module and a pluggable module. The receptacle module includes a cage, a receptacle connector, a biasing spring, and a locking member. The pluggable module is moved from a front end to a back end, so as to be aligned and mated with the receptacle module. The biasing spring is configured to apply a spring load toward the front end of the cage. Accordingly, the mating between the receptacle module and the pluggable module may be accomplished through alignment in the following manner: the pluggable module pushes the receptacle connector toward the back end to compress the biasing spring, so that the receptacle connector is moved toward the back end to the locking member to be mated with the pluggable module.

Abstract: A connector assembly is provided. The connector assembly includes a receptacle module and a pluggable module. The receptacle module includes a cage, a receptacle connector, a biasing spring, and a locking member. The pluggable module is moved from a front end to a back end, so as to be aligned and mated with the receptacle module. The biasing spring is configured to apply a spring load toward the front end of the cage. Accordingly, the mating between the receptacle module and the pluggable module may be accomplished through alignment in the following manner: the pluggable module pushes the receptacle connector toward the back end to compress the biasing spring, so that the receptacle connector is moved toward the back end to the locking member to be mated with the pluggable module.

Abstract: A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack ((OR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56 Gbps using non-return to zero (NRZ) encoding and each cable may he about of less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine. Connections between adjacent server racks can provide for additional compute bandwidth when needed.

Abstract: An electrical connector assembly can include a plug connector and a receptacle connector that can mate together. Conductive communication between the plug and receptacle connectors is established by mating signals terminals and mating ground terminals contained in terminal subassemblies accommodated in each connector. To align and support the signal and ground terminals, the terminals may be part of a terminal wafer and the terminal subassembly can be assembled from one or more wafers. The terminal wafer may include grounding features to improve the electrical characteristics and data transmission through the electrical connector assembly.

Abstract: A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack (MOR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56 Gbps using non-return to zero (NRZ) encoding and each cable may be about or less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine. Connections between adjacent server racks can provide for additional compute bandwidth when needed.

Abstract: An electrical connector assembly can include a plug connector and a receptacle connector that can mate together. Conductive communication between the plug and receptacle connectors is established by mating signals terminals and mating ground terminals contained in terminal subassemblies accommodated in each connector. To align and support the signal and ground terminals, the terminals may be part of a terminal wafer and the terminal subassembly can be assembled from one or more wafers. The terminal wafer may include grounding features to improve the electrical characteristics and data transmission through the electrical connector assembly.

Abstract: A connector assembly is provided. The connector assembly includes a receptacle module and a pluggable module. The receptacle module includes a cage, a receptacle connector, a biasing spring, and a locking member. The pluggable module is moved from a front end to a back end, so as to be aligned and mated with the receptacle module. The biasing spring is configured to apply a spring load toward the front end of the cage. Accordingly, the mating between the receptacle module and the pluggable module may be accomplished through alignment in the following manner: the pluggable module pushes the receptacle connector toward the back end to compress the biasing spring, so that the receptacle connector is moved toward the back end to the locking member to be mated with the pluggable module.

Abstract: A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack (MOR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56 Gbps using non-return to zero (NRZ) encoding and each cable may be about or less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine. Connections between adjacent server racks can provide for additional compute bandwidth when needed.

Abstract: A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack (MOR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56. Gbps using non-return to zero (NRZ) encoding and each cable may be about or less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine.

Abstract: An electrical connector assembly can include a plug connector and a receptacle connector that can mate together. Conductive communication between the plug and receptacle connectors is established by mating signals terminals and mating ground terminals contained in terminal subassemblies accommodated in each connector. To align and support the signal and ground terminals, the terminals may be part of a terminal wafer and the terminal subassembly can be assembled from one or more wafers. The terminal wafer may include grounding features to improve the electrical characteristics and data transmission through the electrical connector assembly.

Abstract: A light emitting diode (LED) fixture is provided. The fixture includes a housing that supports an LED array. A power supply can be coupled to the housing via a connector. A controller with a constant current driver can be configured to actuate the LED array. In an embodiment the controller can be configured to control operation of the LED array based on a sensed signal.

Abstract: An assembly is provided that includes a semiconductor device positioned on a frame and connected to electroplated traces via wire bonding. A connector can be integrated into the frame. Terminals can be molded into the frame. Traces can be connected to the terminals so as to provide a three-dimensional circuit.

Abstract: A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack (MOR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56. Gbps using non-return to zero (NRZ) encoding and each cable may be about or less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine.

Abstract: A method of forming a component module is disclosed. A base is provided, the base being electrically conductive. An insulative layer is also provided on the base, with a first area being substantially free of the insulative layer. First and second traces are provided on the insulative layer adjacent the first area, with these traces extending therefrom. A die is positioned on the first area and electrically connected to the first and second traces. Finally, a protective layer is provided over the die.

Abstract: An LED assembly is disclosed that comprises a based formed around terminals and a substrate. An LED array is positioned on the substrate in a recess. The LED array is electrically coupled to the terminals, which may be part of a connector formed in the base. An emission disk can be positioned over the LED array. If desired, circuitry can be supplied on the base that helps control or condition the supplied power.

Abstract: An assembly is provided that includes a semiconductor device positioned on a frame and connected to electroplated traces via wire bonding. A connector can be integrated into the frame. Terminals can be molded into the frame. Traces can be connected to the terminals so as to provide a three-dimensional circuit.

Abstract: An embodiment includes a holder assembly with terminals that are supported by insert molding. The terminals are electrically connector to conductors, which can be covered with an insulative covering, and thus provide easy to connector holder assemblies. The holder can include features that allow an LED module to be inserted into a recess in the housing and retained via a friction fit. Such a configuration allows the assembly to be shipped as an assembly without the need to solder the LED module to the holder and while still ensuring a reliable electrical connection between the LED module and the corresponding holder assembly.

Abstract: A method of forming a component module is disclosed. A base is provided, the base being electrically conductive. An insulative layer is also provided on the base, with a first area being substantially free of the insulative layer. First and second traces are provided on the insulative layer adjacent the first area, with these traces extending therefrom. A die is positioned on the first area and electrically connected to the first and second traces. Finally, a protective layer is provided over the die.

Abstract: An LED assembly is provided that includes a plurality of LEDs placed along a frame. The plurality of LEDs can include red LEDs, green LEDs and blue LEDs. In an embodiment, the frame can include a common ground and a separate power trace for each color so that the output of each color can be controlled separately. A connector can be integrated into the frame. Terminals can be molded into the frame. Traces can be connected to the terminals so as to provide a three-dimensional circuit.

Abstract: An energy consumption device includes a housing that supports a first and second terminal. An energy consuming module, which may include a light emitting diode array, is supported by the housing and is thermally coupled to a thermal bridge that extends below a lower surface of the housing. A cover can be positioned so as to secure the energy consuming module between the cover and the housing. A plurality of magnets can be configured to secure the energy consumption device to a rail that supports powered contacts so that the first and second terminals engage the powered contacts and the thermal bridge is pressed against the rail.