Patents by Inventor Daniel B Provencher

Daniel B Provencher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210257788
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: January 27, 2021
    Publication date: August 19, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Publication number: 20210234290
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: January 27, 2021
    Publication date: July 29, 2021
    Applicant: Amphenol Corporation
    Inventors: John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Publication number: 20210119371
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 22, 2021
    Applicant: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, Daniel B. Provencher
  • Patent number: 10879643
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: December 29, 2020
    Assignee: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, Jr., Mark W. Gailus, Daniel B. Provencher
  • Publication number: 20200303879
    Abstract: An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.
    Type: Application
    Filed: June 10, 2020
    Publication date: September 24, 2020
    Applicant: Amphenol Corporation
    Inventors: Daniel B. Provencher, Mark W. Gailus, David Manter, Vysakh Sivarajan
  • Patent number: 10720735
    Abstract: An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: July 21, 2020
    Assignee: Amphenol Corporation
    Inventors: Daniel B. Provencher, Mark W. Gailus, David Manter, Vysakh Sivarajan
  • Publication number: 20190173236
    Abstract: An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.
    Type: Application
    Filed: February 11, 2019
    Publication date: June 6, 2019
    Applicant: Amphenol Corporation
    Inventors: Daniel B. Provencher, Mark W. Gailus, David Manter, Vysakh Sivarajan
  • Publication number: 20190109405
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Application
    Filed: November 26, 2018
    Publication date: April 11, 2019
    Applicant: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, Daniel B. Provencher
  • Patent number: 10205286
    Abstract: An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: February 12, 2019
    Assignee: Amphenol Corporation
    Inventors: Daniel B. Provencher, Mark W. Gailus, David Manter, Vysakh Sivarajan
  • Patent number: 10141676
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: November 27, 2018
    Assignee: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, Jr., Mark W. Gailus, Daniel B. Provencher
  • Publication number: 20180109043
    Abstract: An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.
    Type: Application
    Filed: October 19, 2017
    Publication date: April 19, 2018
    Applicant: Amphenol Corporation
    Inventors: Daniel B. Provencher, Mark W. Gailus
  • Patent number: 6764349
    Abstract: An electrical connector system suitable for use in a matrix assembly. The electrical connector assembly has two connectors, each assembled from wafers. Certain of the connectors include a combination of signal and power conductors while others have only signal conductors. In this way, the signal density is maximized.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: July 20, 2004
    Assignee: Teradyne, Inc.
    Inventors: Daniel B Provencher, Thomas S. Cohen, Philip T. Stokoe
  • Patent number: 6739918
    Abstract: An electrical connector assembly suitable for use in a matrix assembly. The electrical connector assembly has two connectors, each assembled from wafers. The individual wafers are shielded and separate shield pieces are positioned in one connector transverse to the wafers in that connector. Additionally, wafers in at least one of the connectors includes a compliant portion that allows the two connectors to be self-aligning.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: May 25, 2004
    Assignee: Teradyne, Inc.
    Inventors: Thomas S. Cohen, Daniel B Provencher, Philip T. Stokoe
  • Publication number: 20030186595
    Abstract: An electrical connector system suitable for use in a matrix assembly. The electrical connector assembly has two connectors, each assembled from wafers. Certain of the connectors include a combination of signal and power conductors while others have only signal conductors. In this way, the signal density is maximized.
    Type: Application
    Filed: March 29, 2002
    Publication date: October 2, 2003
    Inventors: Daniel B. Provencher, Thomas S. Cohen, Philip T. Stokoe
  • Patent number: 5860816
    Abstract: A modular electrical connector made from wafers. Each wafer contains one column of contact elements and is made separately. The wafers are of two different types, which snap together to form two row modules. The modules contain attachment features that allow them to be organized on a metal stiffener. Shield members can be optionally attached to each wafer so that the connector can be made in either a shielded or unshielded versions. In addition, each wafer includes windows through which selected contact elements can be cut to either improve the performance of the shields or to allow attachments of resistors.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: January 19, 1999
    Assignee: Teradyne, Inc.
    Inventors: Daniel B. Provencher, Philip T. Stokoe, Mark W. Gailus
  • Patent number: 5702258
    Abstract: A modular electrical connector made from wafers. Each wafer contains one column of contact elements and is made separately. The wafers are of two different types, which snap together to form two row modules. The modules contain attachment features that allow them to be organized on a metal stiffener. Shield members can be optionally attached to each wafer so that the connector can be made in either a shielded or unshielded versions. In addition, each wafer includes windows through which selected contact elements can be cut to either improve the performance of the shields or to allow attachment of resistors.
    Type: Grant
    Filed: March 28, 1996
    Date of Patent: December 30, 1997
    Assignee: Teradyne, Inc.
    Inventors: Daniel B. Provencher, Philip T. Stokoe, Mark W. Gailus
  • Patent number: 5672064
    Abstract: A durable modular connector assembly, particularly for use as a daughter board connector. The connector is made up of connector modules organized on a stiffener. Each connector module includes an alignment block to frictionally engage contact tails. The stiffener is connected to both the base and the alignment block so that the resulting module is rigidly held together and to the stiffener. The connector is therefore less susceptible to damage.
    Type: Grant
    Filed: December 21, 1995
    Date of Patent: September 30, 1997
    Assignee: Teradyne, Inc.
    Inventors: Daniel B. Provencher, Philip T. Stokoe, David M. McNamara
  • Patent number: 5607326
    Abstract: Electrical connectors are provided with shield units each having a plurality of shields joined by a bridge. Preferably the shield units are mounted in a base stiffened by means apertured to carry mounting ear means.
    Type: Grant
    Filed: June 17, 1996
    Date of Patent: March 4, 1997
    Assignee: Teradyne, Inc.
    Inventors: David M. McNamara, Daniel B. Provencher, Philip T. Stokoe, William E. Howard, Mark W. Gailus
  • Patent number: 5605476
    Abstract: Electrical connectors are provided with shield units each having a plurality of shields joined by a bridge. Preferably the shield units are mounted in a base stiffened by means apertured to carry mounting ear means.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: February 25, 1997
    Assignee: Teradyne, Inc.
    Inventors: David M. McNamara, Daniel B. Provencher, Philip T. Stokoe, William E. Howard, Mark W. Gailus
  • Patent number: 5484310
    Abstract: Electrical connectors are provided with shield units each having a plurality of shields joined by a bridge. Preferably the shield units are mounted in a base stiffened by means apertured to carry mounting ear means.
    Type: Grant
    Filed: March 6, 1995
    Date of Patent: January 16, 1996
    Assignee: Teradyne, Inc.
    Inventors: David M. McNamara, Daniel B. Provencher, Philip T. Stokoe, William E. Howard, Mark W. Gailus