Abstract: A trilayer resist system design and method for patterning organic devices including organic light emitting diode (OLED) devices suited for high-definition light field displays. The trilayer resist system is comprised of a fluoropolymer base layer, an inorganic transfer layer and a top positive-type photoresist layer that protects organics formed upon a substrate from damage resulting from the radiation, developers and solvents used in traditional photolithography techniques and thereby resulting in a high-resolution multi-colored OLED array.

Abstract: A method of photolithography patterning multi-colored organic light emitting diodes (OLED) for a sub 10 um pixel size range, suited for a high-definition light field display, on a single substrate with a multilayer capping layer by way of sputtering deposition for protection of organics with advanced adhesion to the substrate comprising the steps of depositing a first OLED with a capping layer then depositing a second OLED structure on the substrate using a low temperature photoresist patterning process with a capping layer.