Abstract: An apparatus projecting or displaying images to a viewer. The apparatus or Pepper's ghost system projects or displays an image stream onto a reflective element with a first surface receiving and reflecting a portion of light associated with the image stream to the viewer and a second surface opposite the first surface. The apparatus includes a cleaning assembly including an air supply providing a volume of flowing air and an ionizing mechanism for receiving the flowing air and outputting an ionized air flow. The ionized air flow is directed over the second surface of the reflective element. The reflective element is positioned at a non-vertical display angle. An outlet of the cleaning assembly is positioned adjacent an upper edge of the reflective element, and the ionized air flow is output from nozzles as laminar air flow with a flow rate chosen to mitigate dust collection on the upper second surface.

Abstract: An apparatus projecting or displaying images to a viewer. The apparatus or Pepper's ghost system projects or displays an image stream onto a reflective element with a first surface receiving and reflecting a portion of light associated with the image stream to the viewer and a second surface opposite the first surface. The apparatus includes a cleaning assembly including an air supply providing a volume of flowing air and an ionizing mechanism for receiving the flowing air and outputting an ionized air flow. The ionized air flow is directed over the second surface of the reflective element. The reflective element is positioned at a non-vertical display angle. An outlet of the cleaning assembly is positioned adjacent an upper edge of the reflective element, and the ionized air flow is output from nozzles as laminar air flow with a flow rate chosen to mitigate dust collection on the upper second surface.

Abstract: An apparatus and a method for transferring solder bumps from a solder mold to a solder-receiving substrate are disclosed. The apparatus includes a transfer fixture constructed by a base member, a lid member and a compressible member for holding a mold/substrate assembly therein. A plurality of compression pins are mounted through the lid member for supplying a uniform pressure on the mold/substrate assembly and for allowing lateral motion of the mold/substrate assembly relative to the transfer fixture due to a mismatch in the coefficients of thermal expansion. The compressible member is a cellulosic foam sheet which applies a uniform joining force across the entire surface of a wafer and assures abutting contact between the entire wafer and the mold surface. The foam sheet further assists in the lateral movement of the mold/substrate assembly relative to the base member of the transfer fixture.