Patents by Inventor Daniel Billingsley

Daniel Billingsley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11011408
    Abstract: A method used in forming a memory array comprising strings of memory cells comprises forming a stack comprising vertically-alternating first tiers and second tiers. Horizontally-elongated trenches are formed into the stack to form laterally-spaced memory-block regions. Bridge material is formed across the trenches laterally-between and longitudinally-along immediately-laterally-adjacent of the memory-block regions. The bridge material comprises longitudinally-alternating first and second regions. The first regions of the bridge material are ion implanted differently than the second regions of the bridge material to change relative etch rate of one of the first or second regions relative to the other in an etching process.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: May 18, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Daniel Billingsley, Jordan D. Greenlee, Yongjun Jeff Hu
  • Publication number: 20210111064
    Abstract: A method used in forming a memory array comprising strings of memory cells comprises forming a stack comprising vertically-alternating first tiers and second tiers. Horizontally-elongated trenches are formed into the stack to form laterally-spaced memory-block regions. Bridge material is formed across the trenches laterally-between and longitudinally-along immediately-laterally-adjacent of the memory-block regions. The bridge material comprises longitudinally-alternating first and second regions. The first regions of the bridge material are ion implanted differently than the second regions of the bridge material to change relative etch rate of one of the first or second regions relative to the other in an etching process.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 15, 2021
    Applicant: Micron Technology, Inc.
    Inventors: Daniel Billingsley, Jordan D. Greenlee, Yongjun Jeff Hu
  • Publication number: 20210057428
    Abstract: A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Operative channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. Intervening material is laterally-between and longitudinally-along immediately-laterally-adjacent of the memory blocks. The intervening material comprises longitudinally-alternating first and second regions that individually have a vertically-elongated seam therein. The vertically-elongated seam in the first regions are taller than in the second regions. Additional embodiments, including method, are disclosed.
    Type: Application
    Filed: August 25, 2019
    Publication date: February 25, 2021
    Applicant: Micron Technology, Inc.
    Inventors: Yi Hu, Ramey M. Abdelrahaman, Narula Bilik, Daniel Billingsley, Zhenyu Bo, Joan M. Kash, Matthew J. King, Andrew Li, David Neumeyer, Wei Yeeng Ng, Yung K. Pak, Chandra Tiwari, Yiping Wang, Lance Williamson, Xiaosong Zhang
  • Publication number: 20210057440
    Abstract: A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Operative channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. Upper masses comprise first material laterally-between and longitudinally-spaced-along immediately-laterally-adjacent of the memory blocks and second material laterally-between and longitudinally-spaced-along the immediately-laterally-adjacent memory blocks longitudinally-between and under the upper masses. The second material is of different composition from that of the first material. The second material comprises insulative material. Other embodiments, including method, are disclosed.
    Type: Application
    Filed: August 25, 2019
    Publication date: February 25, 2021
    Applicant: Micron Technology, Inc.
    Inventors: Jordan D. Greenlee, Daniel Billingsley, Indra V. Chary, Rita J. Klein
  • Publication number: 20210050252
    Abstract: An apparatus comprises a structure including an upper insulating material overlying a lower insulating material, a conductive element underlying the lower insulating material, and a conductive material comprising a metal line and a contact. The conductive material extends from an upper surface of the upper insulating material to an upper surface of the conductive element. The structure also comprises a liner material adjacent the metal line. A width of an uppermost surface of the conductive material of the metal line external to the contact is relatively less than a width of an uppermost surface of the conductive material of the contact. Related methods, memory devices, and electronic systems are disclosed.
    Type: Application
    Filed: August 16, 2019
    Publication date: February 18, 2021
    Inventors: Xiaosong Zhang, Yongjun J. Hu, David A. Kewley, Md Zahid Hossain, Michael J. Irwin, Daniel Billingsley, Suresh Ramarajan, Robert J. Hanson, Biow Hiem Ong, Keen Wah Chow
  • Patent number: 10916564
    Abstract: Some embodiments include an assembly which has channel material pillars, and which has memory cells along the channel material pillars. A conductive structure is under the channel material pillars. The conductive structure has doped semiconductor material in direct contact with bottom regions of the channel material pillars. One or more of magnesium, scandium, yttrium and lanthanide elements is along the bottom regions of the channel material pillars. Some embodiments include methods of forming assemblies. A structure is formed, and a mass is formed against an upper surface of the structure. Plugs are formed within openings in the mass. The plugs comprise a second material over a first material. The first material includes one or more of magnesium, scandium, yttrium and lanthanide elements. Openings are formed to terminate on the first material, and are then extended through the first material. Channel material pillars are formed within the openings.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: February 9, 2021
    Assignee: Micron Technology, Inc.
    Inventors: David Ross Economy, John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley, Everett A. McTeer
  • Publication number: 20200266210
    Abstract: Some embodiments include an assembly which has channel material pillars, and which has memory cells along the channel material pillars. A conductive structure is under the channel material pillars. The conductive structure has doped semiconductor material in direct contact with bottom regions of the channel material pillars. One or more of magnesium, scandium, yttrium and lanthanide elements is along the bottom regions of the channel material pillars. Some embodiments include methods of forming assemblies. A structure is formed, and a mass is formed against an upper surface of the structure. Plugs are formed within openings in the mass. The plugs comprise a second material over a first material. The first material includes one or more of magnesium, scandium, yttrium and lanthanide elements. Openings are formed to terminate on the first material, and are then extended through the first material. Channel material pillars are formed within the openings.
    Type: Application
    Filed: May 4, 2020
    Publication date: August 20, 2020
    Applicant: Micron Technology, Inc.
    Inventors: David Ross Economy, John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley, Everett A. McTeer
  • Patent number: 10700091
    Abstract: Some embodiments include an assembly which has channel material pillars, and which has memory cells along the channel material pillars. A conductive structure is under the channel material pillars. The conductive structure has doped semiconductor material in direct contact with bottom regions of the channel material pillars. One or more of magnesium, scandium, yttrium and lanthanide elements is along the bottom regions of the channel material pillars. Some embodiments include methods of forming assemblies. A structure is formed, and a mass is formed against an upper surface of the structure. Plugs are formed within openings in the mass. The plugs comprise a second material over a first material. The first material includes one or more of magnesium, scandium, yttrium and lanthanide elements. Openings are formed to terminate on the first material, and are then extended through the first material. Channel material pillars are formed within the openings.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: June 30, 2020
    Assignee: Micron Technology, Inc.
    Inventors: David Ross Economy, John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley, Everett A. McTeer
  • Patent number: 10546848
    Abstract: An integrated assembly includes an insulative mass with a first region adjacent to a second region. The first region has a greater amount of one or more inert interstitial elements incorporated therein than does the second region. Some embodiments include an integrated assembly which has vertically-extending channel material pillars, and which has memory cells along the channel material pillars. A conductive structure is under the channel material pillars. The conductive structure includes doped semiconductor material in direct contact with bottom regions of the channel material pillars. An insulative mass is along the bottom regions of the channel material pillars. The insulative mass has an upper region over a lower region. The lower region has a greater amount of one or more inert interstitial elements incorporated therein than does the upper region. Some embodiments include methods of forming integrated assemblies.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: January 28, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Daniel Billingsley, Everett A. McTeer, Christopher W. Petz, Haoyu Li, John Mark Meldrim, Yongjun Jeff Hu
  • Publication number: 20190355711
    Abstract: An integrated assembly includes an insulative mass with a first region adjacent to a second region. The first region has a greater amount of one or more inert interstitial elements incorporated therein than does the second region. Some embodiments include an integrated assembly which has vertically-extending channel material pillars, and which has memory cells along the channel material pillars. A conductive structure is under the channel material pillars. The conductive structure includes doped semiconductor material in direct contact with bottom regions of the channel material pillars. An insulative mass is along the bottom regions of the channel material pillars. The insulative mass has an upper region over a lower region. The lower region has a greater amount of one or more inert interstitial elements incorporated therein than does the upper region. Some embodiments include methods of forming integrated assemblies.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 21, 2019
    Applicant: Micron Technology, Inc.
    Inventors: Daniel Billingsley, Everett A. McTeer, Christopher W. Petz, Haoyu Li, John Mark Meldrim, Yongjun Jeff Hu
  • Publication number: 20190304996
    Abstract: Some embodiments include an assembly which has channel material pillars, and which has memory cells along the channel material pillars. A conductive structure is under the channel material pillars. The conductive structure has doped semiconductor material in direct contact with bottom regions of the channel material pillars. One or more of magnesium, scandium, yttrium and lanthanide elements is along the bottom regions of the channel material pillars. Some embodiments include methods of forming assemblies. A structure is formed, and a mass is formed against an upper surface of the structure. Plugs are formed within openings in the mass. The plugs comprise a second material over a first material. The first material includes one or more of magnesium, scandium, yttrium and lanthanide elements. Openings are formed to terminate on the first material, and are then extended through the first material. Channel material pillars are formed within the openings.
    Type: Application
    Filed: June 4, 2019
    Publication date: October 3, 2019
    Applicant: Micron Technology, Inc.
    Inventors: David Ross Economy, John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley, Everett A. McTeer
  • Patent number: 10354989
    Abstract: An integrated assembly having an insulative mass with a first region adjacent to a second region. The first region has a greater amount of one or more inert interstitial elements incorporated therein than does the second region. Also, an integrated assembly which has vertically-extending channel material pillars, and which has memory cells along the channel material pillars. A conductive structure is under the channel material pillars. The conductive structure includes doped semiconductor material in direct contact with bottom regions of the channel material pillars. An insulative mass is along the bottom regions of the channel material pillars. The insulative mass has an upper region over a lower region. The lower region has a greater amount of one or more inert interstitial elements incorporated therein than does the upper region. Also, methods of forming integrated assemblies.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: July 16, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Daniel Billingsley, Everett A. McTeer, Christopher W. Petz, Haoyu Li, John Mark Meldrim, Yongjun Jeff Hu
  • Patent number: 10355014
    Abstract: Some embodiments include an assembly which has channel material pillars, and which has memory cells along the channel material pillars. A conductive structure is under the channel material pillars. The conductive structure has doped semiconductor material in direct contact with bottom regions of the channel material pillars. One or more of magnesium, scandium, yttrium and lanthanide elements is along the bottom regions of the channel material pillars. Some embodiments include methods of forming assemblies. A structure is formed, and a mass is formed against an upper surface of the structure. Plugs are formed within openings in the mass. The plugs comprise a second material over a first material. The first material includes one or more of magnesium, scandium, yttrium and lanthanide elements. Openings are formed to terminate on the first material, and are then extended through the first material. Channel material pillars are formed within the openings.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: July 16, 2019
    Assignee: Micron Technology, Inc.
    Inventors: David Ross Economy, John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley, Everett A. McTeer
  • Publication number: 20190198519
    Abstract: Some embodiments include an assembly which has channel material pillars, and which has memory cells along the channel material pillars. A conductive structure is under the channel material pillars. The conductive structure has doped semiconductor material in direct contact with bottom regions of the channel material pillars. One or more of magnesium, scandium, yttrium and lanthanide elements is along the bottom regions of the channel material pillars. Some embodiments include methods of forming assemblies. A structure is formed, and a mass is formed against an upper surface of the structure. Plugs are formed within openings in the mass. The plugs comprise a second material over a first material. The first material includes one or more of magnesium, scandium, yttrium and lanthanide elements. Openings are formed to terminate on the first material, and are then extended through the first material. Channel material pillars are formed within the openings.
    Type: Application
    Filed: December 22, 2017
    Publication date: June 27, 2019
    Inventors: David Ross Economy, John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley, Everett A. McTeer
  • Patent number: 10199531
    Abstract: A heterostructure for use in fabricating an optoelectronic device is provided. The heterostructure includes a layer, such as an n-type contact or cladding layer, that includes thin sub-layers inserted therein. The thin sub-layers can be spaced throughout the layer and separated by intervening sub-layers fabricated of the material for the layer. The thin sub-layers can have a distinct composition from the intervening sub-layers, which alters stresses present during growth of the heterostructure.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: February 5, 2019
    Assignee: Sensor Electronic Technology, Inc.
    Inventors: Daniel Billingsley, Robert M. Kennedy, Wenhong Sun, Rakesh Jain, Maxim S. Shatalov, Alexander Dobrinsky, Michael Shur, Remigijus Gaska
  • Publication number: 20170338371
    Abstract: A heterostructure for use in fabricating an optoelectronic device is provided. The heterostructure includes a layer, such as an n-type contact or cladding layer, that includes thin sub-layers inserted therein. The thin sub-layers can be spaced throughout the layer and separated by intervening sub-layers fabricated of the material for the layer. The thin sub-layers can have a distinct composition from the intervening sub-layers, which alters stresses present during growth of the heterostructure.
    Type: Application
    Filed: July 26, 2017
    Publication date: November 23, 2017
    Applicant: Sensor Electronic Technology, Inc.
    Inventors: Daniel Billingsley, Robert M. Kennedy, Wenhong Sun, Rakesh Jain, Maxim S. Shatalov, Alexander Dobrinsky, Michael Shur, Remigijus Gaska
  • Patent number: 9799793
    Abstract: A heterostructure for use in fabricating an optoelectronic device is provided. The heterostructure includes a layer, such as an n-type contact or cladding layer, that includes thin sub-layers inserted therein. The thin sub-layers can be spaced throughout the layer and separated by intervening sub-layers fabricated of the material for the layer. The thin sub-layers can have a distinct composition from the intervening sub-layers, which alters stresses present during growth of the heterostructure.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: October 24, 2017
    Assignee: Sensor Electronics Technology, Inc.
    Inventors: Daniel Billingsley, Robert M. Kennedy, Wenhong Sun, Rakesh Jain, Maxim S. Shatalov, Alexander Dobrinsky, Michael Shur, Remigijus Gaska
  • Patent number: 9735315
    Abstract: A heterostructure for use in fabricating an optoelectronic device is provided. The heterostructure includes a layer, such as an n-type contact or cladding layer, that includes thin sub-layers inserted therein. The thin sub-layers can be spaced throughout the layer and separated by intervening sub-layers fabricated of the material for the layer. The thin sub-layers can have a distinct composition from the intervening sub-layers, which alters stresses present during growth of the heterostructure.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: August 15, 2017
    Assignee: Sensor Electronic Technology, Inc.
    Inventors: Daniel Billingsley, Robert M. Kennedy, Wenhong Sun, Rakesh Jain, Maxim S. Shatalov, Alexander Dobrinsky, Michael Shur, Remigijus Gaska
  • Publication number: 20170179335
    Abstract: A heterostructure for use in fabricating an optoelectronic device is provided. The heterostructure includes a layer, such as an n-type contact or cladding layer, that includes thin sub-layers inserted therein. The thin sub-layers can be spaced throughout the layer and separated by intervening sub-layers fabricated of the material for the layer. The thin sub-layers can have a distinct composition from the intervening sub-layers, which alters stresses present during growth of the heterostructure.
    Type: Application
    Filed: December 28, 2016
    Publication date: June 22, 2017
    Applicant: Sensor Electronic Technology, Inc.
    Inventors: Daniel Billingsley, Robert M. Kennedy, Wenhong Sun, Rakesh Jain, Maxim S. Shatalov, Alexander Dobrinsky, Michael Shur, Remigijus Gaska
  • Publication number: 20170005228
    Abstract: A heterostructure for use in fabricating an optoelectronic device is provided. The heterostructure includes a layer, such as an n-type contact or cladding layer, that includes thin sub-layers inserted therein. The thin sub-layers can be spaced throughout the layer and separated by intervening sub-layers fabricated of the material for the layer. The thin sub-layers can have a distinct composition from the intervening sub-layers, which alters stresses present during growth of the heterostructure.
    Type: Application
    Filed: September 15, 2016
    Publication date: January 5, 2017
    Applicant: Sensor Electronic Technology, Inc.
    Inventors: Daniel Billingsley, Robert M. Kennedy, Wenhong Sun, Rakesh Jain, Maxim S. Shatalov, Alexander Dobrinsky, Michael Shur, Remigijus Gaska