Patents by Inventor Daniel Biro
Daniel Biro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12147905Abstract: A digital transaction ledger with a DNA-related parameter is provided by obtaining DNA-based data unique to a particular entity, and establishing a DNA-related ledger parameter using the DNA-based data. Further, the method includes associating the DNA-based ledger parameter with a digital transaction ledger, making the digital transaction ledger related, at least in part, to the obtained DNA-based data.Type: GrantFiled: May 5, 2021Date of Patent: November 19, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Andrew C. M. Hicks, Ronald David Boenig, II, Atul Kumar Thapliyal, Scott Woolley, Daniel John FitzGerald, Travis Biro
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Publication number: 20230246167Abstract: The subject matter of the present invention is a method for producing a silicon-carbon composite material. The composite material can be used as an active material for the negative electrode of lithium-ion batteries on a silicon basis or processed further to form such an active material. In the case of use as a lithium store, the composite material is characterized by a particularly high specific capacity and a charging and discharging cycle-dependent life span which is particularly long.Type: ApplicationFiled: June 2, 2021Publication date: August 3, 2023Inventors: Harald Gentischer, Daniel Biro, Peter Haberzettl, Mathias Drews, Jörg Horzel, Lukas Dold
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Patent number: 10593552Abstract: The invention relates to a method for doping semiconductor substrates by means of a co-diffusion process. First, semiconductor substrates are coated at least on one side with a layer containing at least one first dopant. Two of said substrates in each case are arranged in a process chamber in such a way that two of the coated sides thereof are brought in direct contact.Type: GrantFiled: December 16, 2016Date of Patent: March 17, 2020Assignee: Fraunhofer-Gesellschaft Zur Förderung der Angewandten Forschung E.VInventors: Philip Rothhardt, Andreas Wolf, Sebastian Meier, Daniel Biro, Sabrina Lohmüller
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Publication number: 20180374703Abstract: The invention relates to a method for doping semiconductor substrates by means of a co-diffusion process. First, semiconductor substrates are coated at least on one side with a layer containing at least one first dopant. Two of said substrates in each case are arranged in a process chamber in such a way that two of the coated sides thereof are brought in direct contact.Type: ApplicationFiled: December 16, 2016Publication date: December 27, 2018Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V.Inventors: Philip ROTHHARDT, Andreas WOLF, Sebastian MEIER, Daniel BIRO, Sabrina LOHMÜLLER
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Publication number: 20160247945Abstract: The invention relates to a method for producing a metallic contact-connection of a photovoltaic solar cell, including the following method steps: A providing a semiconductor substrate, and B applying an aluminum-containing contact-connection layer indirectly or directly to a side of the semiconductor substrate. The invention is characterized in that in a method step C, a diffusion barrier layer, which acts as a diffusion barrier at least with respect to aluminum, is applied indirectly or directly to the contact-connection layer, and in a method step D, a solderable layer comprised of a solderable material is applied indirectly or directly to the diffusion barrier layer, and in that the diffusion barrier layer and the contact-connection layer are applied by a PVD method.Type: ApplicationFiled: September 23, 2014Publication date: August 25, 2016Applicant: Fraunhofer-Gesellschaft zur Forderung Der Angewand ten Forschung E.V.Inventors: Julia Kumm, Hassan Samadi, Winfried Wolke, Philip Hartmann, Andreas Wolf, Daniel Biro
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Publication number: 20150243804Abstract: A photovoltaic solar cell with a front face designed for coupling light, including at least one cutout (4) extending from the front face to the rear face in the semiconductor substrate (1) of a base doping type, at least one metal feedthrough structure (10), wherein the feedthrough structure (10) is guided in the cutout (4) from the front face to the rear face of the semiconductor substrate and is connected in an electrically conductive manner to the metal front face contact structure (9), which is connected in an electrically conductive manner to an emitter region (2) of the opposite doping to the base doping type, formed on the front face, and at least one rear face contact structure (7), which is connected to the feedthrough structure (10) in an electrically conductive manner and is arranged on the electrically insulating insulation layer (6) on the rear face and covers the isolation layer at least in the regions surrounding the recess (4), and therefore the rear face contact structure (7) is electricallyType: ApplicationFiled: September 12, 2013Publication date: August 27, 2015Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.Inventors: Benjamin Thaidigsmann, Elmar Lohmuller, Florian Clement, Andreas Wolf, Daniel Biro, Ralf Preu
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Patent number: 9087940Abstract: The invention relates to a method for producing a photovoltaic solar cell having a front side designed for coupling in light, comprising the following method steps: A Producing a plurality of cutouts in a semiconductor substrate of a base doping type, B Producing one or more emitter regions of an emitter doping type at least at the front side of the semiconductor substrate, wherein the emitter doping type is opposite to the base doping type, C Applying an electrically insulating insulation layer and D Producing metallic feed through structures in the cutouts, at least one metallic base contact structure at the rear side of the solar cell, which is formed in an electrically conductive manner with the semiconductor substrate in a base doping region, at least one metallic front-side contact structure at the front side of the solar cell, which is formed in an electrically conductive manner with the emitter region at the front side of the semiconductor substrate, and at least one rear-side contact structure at theType: GrantFiled: July 11, 2011Date of Patent: July 21, 2015Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Inventors: Benjamin Thaidigsmann, Florian Clement, Daniel Biro, Andreas Wolf, Ralf Preu
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Patent number: 9023682Abstract: A method for producing a photovoltaic solar cell, including the following steps: A. texturizing a front (2) of a semiconductor substrate; B. generating a selective emitter doping on the front (2) of the semiconductor substrate by generating on the front (2) a first low-doped region (4) and a local high-doped region (3) within the first low-doped region; and C. applying at least one metal emitter contact structure to the front (2) of the semiconductor substrate, at least in the regions of local high doping, wherein, between method steps B and C, a respective silicon oxide layer (5a, 5b) is generated in a method step B1 simultaneously on the front and back of the semiconductor substrate via thermal oxidation.Type: GrantFiled: June 16, 2011Date of Patent: May 5, 2015Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.Inventors: Sebastian Mack, Ulrich Jager, Andreas Wolf, Daniel Biro, Ralf Preu, Gero Kastner
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Patent number: 8927317Abstract: A method for producing a selective doping structure in a semiconductor substrate in order produce a photovoltaic solar cell. The method includes the following steps: A) applying a doping layer (2) to the emitter side of the semiconductor substrate, B) locally heating a melting region of the doping layer (2) and a melting region of the semiconductor substrate lying under the doping layer (2) in such a way that dopant diffuses from the doping layer (2) into the melted semiconductor substrate via liquid-liquid diffusion, so that a high doping region (3) is produced after the melt mixture solidifies, C) producing the planar low doping region by globally heating the semiconductor substrate, D) removing the doping layer (2) and E) removing or converting a layer of the semiconductor substrate on the doping side in such a way that part of the low doping region and of the high doping region close to the surface is removed or is converted into an electrically non-conducting layer.Type: GrantFiled: June 16, 2011Date of Patent: January 6, 2015Assignees: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V., Albert-Ludwigs-Universität FreiburgInventors: Ulrich Jager, Daniel Biro, Anne-Kristin Volk, Johannes Seiffe, Sebastian Mack, Andreas Wolf, Ralf Preu
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Patent number: 8916415Abstract: A method for producing a metallic contact structure for making electrical contact with a photovoltaic solar cell, wherein, in order to create the contact structure, a paste, which contains metal particles, is applied to a surface of a carrier substrate via at least one dispensing opening, wherein the dispensing opening and the carrier substrate are moved in relation to one another during the dispensing of the paste. The paste is circulated in a circulating region, and in each case a part of the paste is branched off out of the circulating region at a plurality of branching points and each branching point is assigned at least one dispensing opening, via which the paste branched off at the branching point is applied to the surface of the carrier substrate, wherein the paste flows through a flow path having a length of less than 1 cm in each case between being branched off out of the circulating region and being dispensed from the dispensing opening assigned to the branching point.Type: GrantFiled: August 29, 2011Date of Patent: December 23, 2014Assignee: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V.Inventors: Daniel Biro, Jan Specht, Daniel Scheffler, Maximilian Pospischil, Florian Clement
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Patent number: 8900472Abstract: A liquid agent for the surface treatment of monocrystalline wafers, which contains an alkaline etching agent and also at least one low-volatile organic compound. Systems of this type can be used both for the cleaning, damage etch and texturing of wafer surfaces in a single etching step and exclusively for the texturing of silicon wafers with different surface quality, whether it now be wire-sawn wafers with high surface damage or chemically polished surfaces with minimum damage density.Type: GrantFiled: June 2, 2010Date of Patent: December 2, 2014Assignee: Fraunhofer-Gesellschaft zur Föerderung der angewandten Forschung E.V.Inventors: Kuno Mayer, Mark Schumann, Daniel Kray, Teresa Orellana Peres, Jochen Rentsch, Martin Zimmer, Elias Kirchgässner, Eva Zimmer, Daniel Biro, Arpad Mihai Rostas, Filip Granek
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Patent number: 8828790Abstract: A method for local contacting and local doping of a semiconductor layer including the following process steps: A) Generation of a layer structure on the semiconductor layer through i) application of at least one intermediate layer on one side of the semiconductor layer, and ii) application of at least one metal layer onto the intermediate layer last applied in step i), wherein the metal layer at least partly covers the last applied intermediate layer, B) Local heating of the layer structure in such a manner that in a local region a short-time melt-mixture of at least partial regions of at least the layers: metal layer, intermediate layer and semiconductor layer, forms. After solidification of the melt-mixture, a contacting is created between metal layer and semiconductor layer. It is essential that in step A) i) at least one intermediate layer designed as dopant layer is applied, which contains a dopant wherein the dopant has a greater solubility in the semiconductor layer than the metal of the metal layer.Type: GrantFiled: August 20, 2009Date of Patent: September 9, 2014Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.Inventors: Ralf Preu, Andreas Grohe, Daniel Biro, Jochen Rentsch, Marc Hofmann, Jan-Frederik Nekarda, Andreas Wolf
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Publication number: 20140174500Abstract: A concentrator system having an optical concentrator and a receiver with a carrier substrate and at least one photovoltaic solar cell. The optical concentrator and the receiver are arranged to concentrate incident electromagnetic radiation onto a front side of the solar cell. The solar cell has at least one base and at least one emitter region and at least one metallic base contact structure electrically conductively connected to the base region for external interconnection, and at least one metallic emitter contact structure is electrically conductively connected to the emitter region external contact. The base and emitter contact structures are arranged on the front side of the solar cell. At least one base back-side metallization is provided, and the solar cell has at least one metallic base via structure that extends from the base back-side metallization to the base contact structure for electrically conductive connection by the base via structure.Type: ApplicationFiled: December 19, 2013Publication date: June 26, 2014Applicant: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung E.V.Inventors: Tobias Fellmeth, Daniel Biro, Florian Clement
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Patent number: 8748310Abstract: A method for producing a metal contact structure of a photovoltaic solar cell, including: applying an electrically non-conductive insulating layer to a semiconductor substrate, applying a metal contact layer to the insulating layer, and generating a plurality of local electrically conductive connections between the semiconductor substrate and the contact layer right through the insulating layer. The metal contact layer is formed using two pastes containing metal particles: the first paste containing metal particles is applied to local regions, and the second paste containing metal particles is applied covering at least the regions covered with the first paste and partial regions located therebetween.Type: GrantFiled: June 16, 2011Date of Patent: June 10, 2014Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.Inventors: Daniel Biro, Benjamin Thaidigsmann, Florian Clement, Robert Woehl, Edgar-Allan Wotke
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Publication number: 20140026936Abstract: A photovoltaic solar cell for converting incident electromagnetic radiation into electrical energy, including at least one base region of a base-doping type, designed in a silicon substrate; at least one emitter region of an emitter-doping type that is of an opposite doping type to the base-doping type; at least one metallic base-contacting structure connected, in an electrically conductive manner, to the base region, and at least one metallic emitter-contacting structure connected, in an electrically conductive manner, to the emitter region, the base region and emitter region being arranged in such a manner that a pn-junction is formed at least in some regions between said base and emitter regions.Type: ApplicationFiled: January 26, 2012Publication date: January 30, 2014Applicant: Fraunhofer-Gesellschaft Zur Forderung Der Angewand ten Forschung E.V.Inventors: Benjamin Thaidigsmann, Florian Clement, Andreas Wolf, Daniel Biro
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Publication number: 20130224906Abstract: A method for producing a metallic contact structure for making electrical contact with a photovoltaic solar cell, wherein, in order to create the contact structure, a paste, which contains metal particles, is applied to a surface of a carrier substrate via at least one dispensing opening, wherein the dispensing opening and the carrier substrate are moved in relation to one another during the dispensing of the paste. The paste is circulated in a circulating region, and in each case a part of the paste is branched off out of the circulating region at a plurality of branching points and each branching point is assigned at least one dispensing opening, via which the paste branched off at the branching point is applied to the surface of the carrier substrate, wherein the paste flows through a flow path having a length of less than 1 cm in each case between being branched off out of the circulating region and being dispensed from the dispensing opening assigned to the branching point.Type: ApplicationFiled: August 29, 2011Publication date: August 29, 2013Applicant: Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V.Inventors: Daniel Biro, Jan Specht, Daniel Scheffler, Maximilian Pospischil, Florian Clement
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Publication number: 20130157401Abstract: A method for producing a selective doping structure in a semiconductor substrate in order produce a photovoltaic solar cell. The method includes the following steps: A) applying a doping layer (2) to the emitter side of the semiconductor substrate, B) locally heating a melting region of the doping layer (2) and a melting region of the semiconductor substrate lying under the doping layer (2) in such a way that dopant diffuses from the doping layer (2) into the melted semiconductor substrate via liquid-liquid diffusion, so that a high doping region (3) is produced after the melt mixture solidifies, C) producing the planar low doping region by globally heating the semiconductor substrate, D) removing the doping layer (2) and E) removing or converting a layer of the semiconductor substrate on the doping side in such a way that part of the low doping region and of the high doping region close to the surface is removed or is converted into an electrically non-conducting layer.Type: ApplicationFiled: June 16, 2011Publication date: June 20, 2013Applicant: ALBERT-LUDWIGS-UNIVERSITAT FREIBURGInventors: Ulrich Jäger, Daniel Biro, Anne-Kristin Volk, Johannes Seiffe, Sebastian Mack, Andreas Wolf, Ralf Preu
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Publication number: 20130112262Abstract: The invention relates to a method for producing a photovoltaic solar cell having a front side designed for coupling in light, comprising the following method steps: A Producing a plurality of cutouts in a semiconductor substrate of a base doping type, B Producing one or more emitter regions of an emitter doping type at least at the front side of the semiconductor substrate, wherein the emitter doping type is opposite to the base doping type, C Applying an electrically insulating insulation layer and D Producing metallic feed through structures in the cutouts, at least one metallic base contact structure at the rear side of the solar cell, which is formed in an electrically conductive manner with the semiconductor substrate in a base doping region, at least one metallic front-side contact structure at the front side of the solar cell, which is formed in an electrically conductive manner with the emitter region at the front side of the semiconductor substrate, and at least one rear-side contact structure at theType: ApplicationFiled: July 11, 2011Publication date: May 9, 2013Applicant: Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V.Inventors: Benjamin Thaidigsmann, Florian Clement, Daniel Biro, Andreas Wolf, Ralf Preu
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Publication number: 20130095604Abstract: A method for producing a metal contact structure of a photovoltaic solar cell, including: applying an electrically non-conductive insulating layer to a semiconductor substrate, applying a metal contact layer to the insulating layer, and generating a plurality of local electrically conductive connections between the semiconductor substrate and the contact layer right through the insulating layer. The metal contact layer is formed using two pastes containing metal particles: the first paste containing metal particles is applied to local regions, and the second paste containing metal particles is applied covering at least the regions covered with the first paste and partial regions located therebetween.Type: ApplicationFiled: June 16, 2011Publication date: April 18, 2013Inventors: Daniel Biro, Benjamin Thaidigsmann, Florian Clement, Robert Woehl, Edgar-Allan Wotke
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Publication number: 20130095595Abstract: A method for producing a photovoltaic solar cell, including the following steps: A. texturizing a front (2) of a semiconductor substrate; B. generating a selective emitter doping on the front (2) of the semiconductor substrate by generating on the front (2) a first low-doped region (4) and a local high-doped region (3) within the first low-doped region; and C. applying at least one metal emitter contact structure to the front (2) of the semiconductor substrate, at least in the regions of local high doping, wherein, between method steps B and C, a respective silicon oxide layer (5a, 5b) is generated in a method step B1 simultaneously on the front and back of the semiconductor substrate via thermal oxidation.Type: ApplicationFiled: June 16, 2011Publication date: April 18, 2013Applicant: Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V.Inventors: Sebastian Mack, Ulrich Jager, Andreas Wolf, Daniel Biro, Ralf Preu, Gero Kastner