Patent number: 11980009
Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
Type:
Grant
Filed:
September 9, 2022
Date of Patent:
May 7, 2024
Assignee:
Ciena Corporation
Inventors:
Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud