Abstract: Devices and methods for mounting intercom devices are described herein. The devices include a housing for receiving electrical components therein. The housing includes a back panel, side panels extending from the back panel, and a front panel coupled to the side panels. The front panel includes a perimeter, which, coupled to the side panels, forms a recess within the housing. The recess is configured to receive the intercom device such that the intercom device is flush with the front panel when the intercom device is fully inserted into the housing. The devices enable the intercom device to be mounted to mounting surfaces including corners of adjacent walls, framed structures, and openings inside the surface. This configuration alleviates complex or expensive installation and vandalism issues associated with intercom devices.