Patents by Inventor Daniel Buergi

Daniel Buergi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME
    Publication number: 20250385216
    Abstract: A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.
    Type: Application
    Filed: September 9, 2025
    Publication date: December 18, 2025
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Andreas Marte, Daniel Buergi, Urban Ernst, Eirini Kakkava, Alexander Holzer, Mathias Moser, Fabian Schneider
  • Die bonding systems, and methods of using the same
    Patent number: 12438117
    Abstract: A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: October 7, 2025
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Andreas Marte, Daniel Buergi, Urban Ernst, Eirini Kakkava, Alexander Holzer, Mathias Moser, Fabian Schneider