Patents by Inventor Daniel Burgstaller

Daniel Burgstaller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10272660
    Abstract: A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: April 30, 2019
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Jurgen Burggraf, Daniel Burgstaller
  • Patent number: 9449863
    Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: September 20, 2016
    Assignee: EV Group GmbH
    Inventors: Jurgen Burggraf, Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller
  • Patent number: 9378996
    Abstract: This invention relates to a mounting apparatus for mounting and supporting one structure side of a substrate, which structure side has structures thereon. The apparatus having a mounting element with a flat mounting surface for supporting the structures and a suction surface F2 which penetrates the mounting surface solely in an outer ring surface for effecting a fluid flow which produces suctions on the substrate.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: June 28, 2016
    Assignee: EV Group W. Thallner GmbH
    Inventors: Werner Thallner, Daniel Burgstaller
  • Patent number: 9296193
    Abstract: A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: March 29, 2016
    Assignee: EV Group E. Thallner GmbH
    Inventors: Jürgen Burggraf, Daniel Burgstaller
  • Patent number: 9278433
    Abstract: A workholding fixture for holding flat semiconductor substrates with a carrier, a holding body which is fixed or which can be fixed on the carrier with a holding side which faces away from the carrier and at least one negative pressure channel which penetrates the holding body with one suction end on the holding side, the holding side having a defined suction structure of soft material.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: March 8, 2016
    Assignee: EV GROUP GMBH
    Inventors: Herbert Tiefenböck, Jürgen Burggraf, Stefan Pargfrieder, Daniel Burgstaller
  • Publication number: 20160020124
    Abstract: A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.
    Type: Application
    Filed: September 30, 2015
    Publication date: January 21, 2016
    Applicant: EV GROUP E. THALLNER GMBH
    Inventors: Jurgen Burggraf, Daniel Burgstaller
  • Publication number: 20150089783
    Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
    Type: Application
    Filed: November 10, 2014
    Publication date: April 2, 2015
    Applicant: EV Group GmbH
    Inventors: Jurgen BURGGRAF, Friedrich Paul LINDNER, Stefan PARGFRIEDER, Daniel BURGSTALLER
  • Patent number: 8918989
    Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: December 30, 2014
    Assignee: EV Group GmbH
    Inventors: Jürgen Burggraf, Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller
  • Publication number: 20140159321
    Abstract: This invention relates to a mounting apparatus for mounting and supporting one structure side of a substrate, which structure side has structures thereon. The apparatus having a mounting element with a flat mounting surface for supporting the structures and a suction surface F2 which penetrates the mounting surface solely in an outer ring surface for effecting a fluid flow which produces suctions on the substrate.
    Type: Application
    Filed: August 12, 2011
    Publication date: June 12, 2014
    Inventors: Werner Thallner, Daniel Burgstaller
  • Publication number: 20140020847
    Abstract: A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the product substrate.
    Type: Application
    Filed: April 11, 2011
    Publication date: January 23, 2014
    Inventors: Jürgen Burggraf, Daniel Burgstaller
  • Publication number: 20120146273
    Abstract: A workholding fixture for holding flat semiconductor substrates with a carrier, a holding body which is fixed or which can be fixed on the carrier with a holding side which faces away from the carrier and at least one negative pressure channel which penetrates the holding body with one suction end on the holding side, the holding side having a defined suction structure of soft material.
    Type: Application
    Filed: March 31, 2010
    Publication date: June 14, 2012
    Inventors: Herbert Tiefenböck, Jürgen Burggraf, Stefan Pargfrieder, Daniel Burgstaller
  • Publication number: 20120110825
    Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate, the device having: aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by action on the substrate's outside contour, whereby the orientation along a substrate plane E that is formed with the carrier substrate is carried out by a contact surface of the substrate, and attaching means for at least partial prefixing of the oriented substrate on the carrier substrate.
    Type: Application
    Filed: March 31, 2010
    Publication date: May 10, 2012
    Inventors: Jürgen Burggraf, Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller