Patents by Inventor Daniel C. Blazej

Daniel C. Blazej has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5142439
    Abstract: A high-voltage, low-volume capacitor module, having a minimal amount of inherent stray inductance, and being configured so as to allow its integration into an electrical system in a manner which minimizes any stray inductance introduced by interconnection wiring. This is accomplished by integrating the capacitor into the bus bars of the voltage convertor, thereby eliminating the need for separate interconnecting wiring and reducing the overall amount of stray inductance evident within the system in which the capacitor is employed.
    Type: Grant
    Filed: August 28, 1991
    Date of Patent: August 25, 1992
    Assignee: Allied-Signal Inc.
    Inventors: Colin E. Huggett, Leon D. Lewis, Robert Rudich, John L. Scharf, Daniel C. Blazej
  • Patent number: 5139880
    Abstract: A predetermined pattern of a dielectric polymer is formed on a substrate from a mixture of prepolymers which are the ethers of the oligomeric condensation product of (a) dihydric phenol and formaldehyde and (b) a dialdehyde and 3 to 4 moles of a phenol.
    Type: Grant
    Filed: December 18, 1990
    Date of Patent: August 18, 1992
    Assignee: Allied-Signal Inc.
    Inventors: Joseph J. Zupancic, Daniel C. Blazej, Howard A. Fraenkel
  • Patent number: 5120569
    Abstract: A predetermined pattern of a dielectric polymer is formed on a substrate from a prepolymer which is an ether of the oligomeric condensation product of a dihydric phenol and formaldehyde having the formula ##STR1##
    Type: Grant
    Filed: December 18, 1990
    Date of Patent: June 9, 1992
    Assignee: Allied-Signal Inc.
    Inventors: Joseph J. Zupancic, Daniel C. Blazej, Howard A. Fraenkel
  • Patent number: 5114741
    Abstract: A predetermined pattern of a dielectric polymer is formed on a substrate from a mixture of prepolymers which are ethers of the reaction products of (a) a dicyclopentadiene and a phenol and (b) a dialdehyde and 3 to 4 moles of a phenol.
    Type: Grant
    Filed: December 19, 1990
    Date of Patent: May 19, 1992
    Assignee: Allied-Signal Inc.
    Inventors: Joseph J. Zupancic, Daniel C. Blazej, Howard A. Fraenkel
  • Patent number: 5085886
    Abstract: A predetermined pattern of a dielectric polymer is formed on a substrate from a prepolymer which is an ether of the reaction product of a dicyclopentadiene and a phenol.
    Type: Grant
    Filed: December 19, 1990
    Date of Patent: February 4, 1992
    Assignee: Allied-Signal Inc.
    Inventors: Joseph J. Zupancic, Daniel C. Blazej, Howard A. Fraenkel
  • Patent number: 4997698
    Abstract: The present invention is directed to a ceramic coated metal substrate having improved processibility characteristics in the manufacture of electronic devices, as for example electronic circuits, and to processes for manufacture of such devices.
    Type: Grant
    Filed: June 23, 1989
    Date of Patent: March 5, 1991
    Assignee: Allied-Signal, Inc.
    Inventors: Reza Oboodi, Daniel C. Blazej
  • Patent number: 4794048
    Abstract: The present invention is directed to a ceramic coated metal substrate having improved processibility characteristics in the manufacture of electronic devices, as for example electronic circuits, and to processes for manufacture of such devices.
    Type: Grant
    Filed: May 4, 1987
    Date of Patent: December 27, 1988
    Assignee: Allied-Signal Inc.
    Inventors: M. Reza Oboodi, Daniel C. Blazej
  • Patent number: 4733328
    Abstract: This invention relates to a laminated capacitive element for use in electrical devices such as filtered connectors, said element comprising a laminated body of a metal substrate having one or more layered structures heat bonded to all or a portion of the surfaces thereof, said structures comprising a non-conductive layer composed of a sintered finely divided non-conductive material heat bonded to said metal substrate and a metal conductive layer composed of sintered finely divided metal heat bonded to said sintered non-conductive material.
    Type: Grant
    Filed: December 18, 1986
    Date of Patent: March 22, 1988
    Assignee: Allied Corporation
    Inventor: Daniel C. Blazej